4-channel BTL driver for CD players
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| Parts packaging code | SOIC |
| package instruction | HSOP-28 |
| Contacts | 28 |
| Reach Compliance Code | compli |
| Commercial integrated circuit types | CONSUMER CIRCUIT |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e3/e2 |
| length | 18.5 mm |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 2.41 mm |
| Maximum slew rate | 14.5 mA |
| Maximum supply voltage (Vsup) | 12 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN/TIN COPPER |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| width | 7.5 mm |
| BA6997FP | BA6997 | BA6997FM | |
|---|---|---|---|
| Description | 4-channel BTL driver for CD players | 4-channel BTL driver for CD players | 4-channel BTL driver for CD players |
| Is it lead-free? | Lead free | - | Lead free |
| Is it Rohs certified? | conform to | - | conform to |
| Maker | ROHM Semiconductor | - | ROHM Semiconductor |
| Parts packaging code | SOIC | - | SOIC |
| package instruction | HSOP-28 | - | HSSOP, |
| Contacts | 28 | - | 28 |
| Reach Compliance Code | compli | - | compli |
| Commercial integrated circuit types | CONSUMER CIRCUIT | - | CONSUMER CIRCUIT |
| JESD-30 code | R-PDSO-G28 | - | R-PDSO-G28 |
| JESD-609 code | e3/e2 | - | e3/e2 |
| length | 18.5 mm | - | 18.5 mm |
| Number of terminals | 28 | - | 28 |
| Maximum operating temperature | 85 °C | - | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | HSSOP | - | HSSOP |
| Package shape | RECTANGULAR | - | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 |
| Certification status | Not Qualified | - | Not Qualified |
| Maximum seat height | 2.41 mm | - | 2.41 mm |
| Maximum slew rate | 14.5 mA | - | 14.5 mA |
| Maximum supply voltage (Vsup) | 12 V | - | 12 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V |
| surface mount | YES | - | YES |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL |
| Terminal surface | TIN/TIN COPPER | - | TIN/TIN COPPER |
| Terminal form | GULL WING | - | GULL WING |
| Terminal pitch | 0.8 mm | - | 0.8 mm |
| Terminal location | DUAL | - | DUAL |
| Maximum time at peak reflow temperature | 10 | - | 10 |
| width | 7.5 mm | - | 7.5 mm |
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