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B37578K9123K062

Description
CAPACITOR, CERAMIC, MULTILAYER, 16V, 0.012uF, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    capacitor   
File Size131KB,7 Pages
ManufacturerEPCOS (TDK)
Download Datasheet Parametric View All

B37578K9123K062 Overview

CAPACITOR, CERAMIC, MULTILAYER, 16V, 0.012uF, SURFACE MOUNT, 1206, CHIP

B37578K9123K062 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerEPCOS (TDK)
package instruction, 1206
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.012 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberB37578
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, BLISTER, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)16 V
size code1206
surface mountYES
Terminal surfaceTin (Sn)
Terminal shapeWRAPAROUND
Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
HC1 / 1206 / 16V
B37578K9******
1206 High Cap Class 1 Capacitor
Todays electronic devices need more and more capacitors of small dimensions but high cap values of
class 1 characteristic (based on non-ferroelectric materials)
EPCOS HC1 capacitors provide high cap values in small chip sizes due to their special ceramic
material with a very high dielectric constant (ε) which is more than 5 times higher than the
ε
of the
conventional C0G – material.
The electrical behaviour of these capacitors are very close to that of the C0G-material, except for the
Temperature coefficient of capacitance (TCC) which is higher but does not exceed ± 4% between –
25°C and +85°C.
Features
High capacitance values
Characteristic of class 1 dielectric
Reduced chip thickness
No ageing effects
No voltage dependence
No piezoelectric effect
Nearly linear temperature coefficient of capacitance (TCC)
Low dielectric absorption
Suitable for Pb-free soldering processes
Applications
Mobile phones
Portable handheld products (e.g. PDA)
Notebook
Bluetooth applications
Remote keyless entry systems
ADSL – applications
USB Hub controllers
Set top boxes
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
1/7
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