2 Lead Metal Package, 3.2 mm x 8 mm
Product Features:
Low Cost
RoHs Compliant
Compatible with Leadfree Processing
UM1 / UM4 / UM5 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
Frequency
7 MHz to 160.000 MHz
ESR (Equivalent Series Resistance)
7.0 MHz – 9.9 MHz
10.0 MHz – 14.9 MHz
15 MHz – 29.9 MHz
30 MHz – 36 MHz
rd
30 MHz – 49.9 MHz (3 O.T.)
rd
50 MHz – 100 MHz (3 O.T.)
th
75 MHz – 160 MHz (5 O.T.)
100
Ω
Max.
60
Ω
Max.
30
Ω
Max.
20
Ω
Max.
70
Ω
Max.
50
Ω
Max.
100
Ω
Max.
Shunt Capacitance (C0)
Frequency Tolerance @ 25°
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
7 pF Max.
±30
ppm Standard (see Part Number Guide for more options)
±50
ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
±5
ppm Max. / Year Standard
0° C to +70° C Standard (see Part Number Guide for more options)
-40° C to +85° C Standard
Part Number Guide
Package
Stability
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
UM1 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
5 = 5
th
overtone
Load Capacitance
(pF)
Frequency
UM1 -
(8.0 mm H)
UM4 -
(4.7 mm H)
18 pF Standard
Or Specify
- 20.000 MHz
UM5 -
(6.0 mm H)
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 1
2 Lead Metal Package, 3.2 mm x 8 mm
Pb Free Solder Reflow Profile:
UM1 / UM4 / UM5 Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI
Line 2: Frequency
Line 3: Date Code
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 2
Microcontroller MCU
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