PMG50002001AA datasheet, PDF - EEWORLD Datasheet

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PMG50002001AA: DescriptionMicroprocessor, 32-Bit, 500MHz, CMOS; CategoryThe embedded processor and controller Microcontrollers and processors; File Size893KB，64 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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PMG50002001AA Overview

Microprocessor, 32-Bit, 500MHz, CMOS

PMG50002001AA Parametric

Parameter Name	Attribute value
Maker	Intel
package instruction	,
Reach Compliance Code	unknow
ECCN code	3A001.A.3
Address bus width	14
bit size	32
boundary scan	YES
maximum clock frequency	500 MHz
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	R-XXMA-X
low power mode	YES
Maximum operating temperature	55 °C
Minimum operating temperature
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
speed	500 MHz
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	UNSPECIFIED
Terminal location	UNSPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

PMG50002001AA Preview

Pentium

III Processor Mobile Module:

Mobile Module Connector 2 (MMC-2)

Datasheet

Product Features

Mobile Pentium

III

processor at speeds of

450 MHz and 500 MHz

On-die, primary 16-K Instruction cache and

16-K Write Back Data cache

On-die, 256-K L2 cache

— Eight-way set associative

— Runs at the speed of the processor core

Fully compatible with previous Intel

mobile microprocessors

— Binary compatible with all applications

— Support for MMX™ technology

Supports streaming SIMD

Power management features that provide

low-power dissipation

— Quick Start mode

— Deep Sleep mode

Integrated math co-processor

Integrated Active Thermal Feedback (ATF)

system

Programmable trip point interrupt or poll

mode for temperature reading

Intel 82443BX Host Bridge system

controller

— DRAM controller supports 3.3-V

SDRAM at 100 MHz

— Supports PCI CLKRUN# protocol

— SDRAM clock enable support and self-

refresh of SDRAM during Suspend

mode

— PCI bus control 3.3V only,

PCI

Specification Revision 2.1

compliant

Supports single AGP 66-MHz, 3.3-V

device

Two-piece TTP thermal transfer plate

(TTP) for heat dissipation

— The CPU TTP is made of nickel-plated

copper

— The BX TTP is made of aluminum

Pentium

III

processor core voltage

regulation supports input voltages from

7.5V to 21.0V DC

— Above 80% peak efficiency

— Integrated VR solution

245304-002

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not

intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Pentium III processor mobile module may contain design defects or errors known as errata which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled

platforms may require licenses from various entities, including Intel Corporation.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-

548-4725 or by visiting Intel’s website at http://www.intel.com.

*Other brands and names are the property of their respective owners.

Datasheet

245304-002

Pentium

III Processor Mobile Module MMC-2

Contents

1.0

2.0

3.0

Introduction......................................................................................................................... 1

1.1

References ............................................................................................................ 1

Architecture Overview ........................................................................................................2

Signal Information ..............................................................................................................4

3.1

Signal Definitions................................................................................................... 4

3.1.1 Signal List.................................................................................................5

3.1.2 Memory Signal Description ...................................................................... 6

3.1.3 AGP Signals ............................................................................................. 7

3.1.4 PCI Signals............................................................................................... 9

3.1.5 Processor and PIIX4E/M Sideband Signals ...........................................11

3.1.6 Power Management Signals ..................................................................12

3.1.7 Clock Signals..........................................................................................13

3.1.8 Voltage Signals ......................................................................................14

3.1.9 ITP and JTAG Pins.................................................................................15

3.1.10 Miscellaneous Pins.................................................................................15

Connector Pin Assignments ................................................................................16

Pin and Pad Assignments ...................................................................................18

Pentium III Processor Mobile Module MMC-2.....................................................20

L2 Cache .............................................................................................................20

The 82443BX Host Bridge System Controller .....................................................20

4.3.1 Memory Organization .............................................................................20

4.3.2 Reset Strap Options ...............................................................................21

4.3.3 PCI Interface ..........................................................................................21

4.3.4 AGP Interface.........................................................................................22

Power Management ............................................................................................22

4.4.1 Clock Control Architecture......................................................................22

4.4.1.1 Normal State .............................................................................24

4.4.1.2 Auto Halt State ..........................................................................24

4.4.1.3 Stop Grant State........................................................................25

4.4.1.4 Quick Start State .......................................................................25

4.4.1.5 HALT/Grant Snoop State ..........................................................26

4.4.1.6 Sleep State ................................................................................26

4.4.1.7 Deep Sleep State ......................................................................26

Power Consumption in Power Management Mode .............................................27

System Bus Clock Signal Quality Specifications.................................................28

5.1.1 BCLK DC Specifications.........................................................................28

5.1.2 BCLK AC Specifications.........................................................................28

System Power Requirements..............................................................................30

Processor Core Voltage Regulation ....................................................................30

5.3.1 Voltage Regulator Efficiency ..................................................................30

5.3.2 Voltage Regulator Control ......................................................................32

3.2

3.3

4.0

4.1

4.2

4.3

Functional Description......................................................................................................20

4.4

4.5

5.0

5.1

Electrical Specifications....................................................................................................28

5.2

5.3

245304-002

Datasheet

iii

Pentium

III Processor Mobile Module MMC-2

5.4

5.5

6.0

6.1

Power Planes: Bulk Capacitance Requirements.................................... 34

System Power Supply Protection Guidelines ......................................... 36

5.3.4.1 DC Power System Protection.................................................... 36

5.3.4.2 V_DC Power Supply.................................................................. 37

5.3.4.3 Overcurrent Protection .............................................................. 37

5.3.4.4 Current Limit Shift Point ............................................................ 39

5.3.4.5 Slew Rate Control ..................................................................... 41

5.3.4.6 Undervoltage Lockout ............................................................... 43

5.3.4.7 Overvoltage Lockout ................................................................. 44

Active Thermal Feedback ................................................................................... 48

Thermal Sensor Configuration Register.............................................................. 48

Module Dimensions............................................................................................. 49

6.1.1 Pin 1 Location of the MMC-2 Connector ................................................ 49

6.1.2 Printed Circuit Board .............................................................................. 50

6.1.3 Height Restrictions ................................................................................. 51

Thermal Transfer Plate ....................................................................................... 51

Module Physical Support .................................................................................... 53

6.3.1 Module Mounting Requirements ............................................................ 53

6.3.2 Module Weight ....................................................................................... 54

Thermal Design Power........................................................................................ 55

5.3.3

5.3.4

Mechanical Specification.................................................................................................. 49

6.2

6.3

7.0

8.0

9.0

Thermal Specification....................................................................................................... 55

7.1

Labeling Information......................................................................................................... 56

Environmental Standards................................................................................................. 58

Figures

Pentium III Processor Mobile Module Block Diagram ........................................... 3

MMC-2 Connector Pad Footprint ........................................................................ 19

Clock Control States ........................................................................................... 24

BCLK Waveform at the Processor Core Pins ..................................................... 29

VR Efficiency Chart ............................................................................................ 31

Power Sequence Timing ..................................................................................... 34

V_DC Ripple Current .......................................................................................... 36

V_DC Power System Protection Block Diagram................................................. 37

Overcurrent Protection Circuit............................................................................. 38

Current Shift Model ............................................................................................. 39

Undervoltage Lockout ......................................................................................... 43

Undervoltage Lockout Model .............................................................................. 44

Overvoltage Lockout ........................................................................................... 45

Overvoltage Lockout Model ................................................................................ 45

Recommended Power Supply Protection Circuit for the System Electronics ..... 47

Simulation of V_DC Voltage Skew...................................................................... 47

Board Dimensions and MMC-2 Connector Orientation....................................... 49

Board Dimensions and MMC-2 Connector—Pin 1 Orientation ........................... 50

Datasheet

245304-002

Pentium

III Processor Mobile Module MMC-2

Printed Circuit Board Thickness ..........................................................................50

Keep-out Zone.....................................................................................................51

82443BX Thermal Transfer Plate (Reference Only) ..........................................52

82443BX Thermal Transfer Plate Detail..............................................................52

CPU Thermal Transfer Plate (Reference Only)...................................................53

Standoff Holes, Board Edge Clearance, and EMI Containment Ring .................54

Product Tracking Code........................................................................................57

Tables

Connector Signal Summary .................................................................................. 4

Memory Signal Descriptions.................................................................................. 6

AGP Signal Descriptions ....................................................................................... 7

PCI Signal Descriptions......................................................................................... 9

Processor and PIIX4E/M Sideband Signal Descriptions .....................................11

Power Management Signal Descriptions ............................................................12

Clock Signal Descriptions....................................................................................13

Voltage Descriptions ...........................................................................................14

ITP and JTAG Pins..............................................................................................15

Miscellaneous Pin Descriptions...........................................................................15

Connector Pin Assignment..................................................................................16

Connector Specifications.....................................................................................19

Configuration Straps for the 82443BX Host Bridge System Controller ...............21

Clock State Characteristics .................................................................................23

Power Consumption Values ................................................................................27

BCLK DC Specifications......................................................................................28

BCLK AC Specifications at the Processor Core Pins..........................................28

BCLK Signal Quality AC Specifications at the Processor Core...........................29

System Power Requirements..............................................................................30

Vcore Power Conversion Efficiency ...................................................................31

Voltage Signal Definitions and Sequences .........................................................32

VR_ON In-rush Current.......................................................................................33

Bulk Capacitance Requirements .........................................................................35

Thermal Sensor SMBus Address ........................................................................48

Thermal Sensor Configuration Register ..............................................................48

Thermal Design Power Specification ..................................................................55

Environmental Standards ....................................................................................58

245304-002

Datasheet

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PMG50002001AA Related Products

	PMG50002001AA	PMI45002001AA	PMI50002001AA	PME45002001AA	PME50002001AA	PMG45002001AA
Description	Microprocessor, 32-Bit, 500MHz, CMOS	Microprocessor, 32-Bit, 500MHz, CMOS	Microprocessor, 32-Bit, 500MHz, CMOS	Microprocessor, 32-Bit, 450MHz, CMOS	Microprocessor, 32-Bit, 500MHz, CMOS	Microprocessor, 32-Bit, 450MHz, CMOS
Maker	Intel	Intel	Intel	Intel	Intel	Intel
Reach Compliance Code	unknow	unknown	unknown	unknow	unknow	unknow
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	14	14	14	14	14	14
bit size	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES
maximum clock frequency	500 MHz	450 MHz	500 MHz	450 MHz	500 MHz	450 MHz
External data bus width	64	64	64	64	64	64
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES
JESD-30 code	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X
low power mode	YES	YES	YES	YES	YES	YES
Maximum operating temperature	55 °C	55 °C	55 °C	55 °C	55 °C	55 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	500 MHz	500 MHz	500 MHz	450 MHz	500 MHz	450 MHz
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Terminal location	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR

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