TC514102AZ-60 datasheet, PDF - EEWORLD Datasheet

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TC514102AZ-60: Description4,194,304 x 1 BIT DYNAMIC RAM; Categorystorage storage; File Size608KB，20 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC514102AZ-60 Overview

4,194,304 x 1 BIT DYNAMIC RAM

TC514102AZ-60 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	ZIP
package instruction	ZIP,
Contacts	20
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	STATIC COLUMN
Maximum access time	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-PZIP-T20
JESD-609 code	e0
length	25.8 mm
memory density	4194304 bi
Memory IC Type	STATIC COLUMN DRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	20
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	10.16 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

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TC514102AZ-60 Related Products

	TC514102AZ-60	TC514102AP-60	TC514102AJ-60	TC514102ASJ-60	TC514102AP
Description	4,194,304 x 1 BIT DYNAMIC RAM	4,194,304 x 1 BIT DYNAMIC RAM	4,194,304 x 1 BIT DYNAMIC RAM	4,194,304 x 1 BIT DYNAMIC RAM	4,194,304 x 1 BIT DYNAMIC RAM
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	-
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	-
Parts packaging code	ZIP	DIP	SOJ	SOJ	-
package instruction	ZIP,	DIP,	SOJ,	SOJ,	-
Contacts	20	18	20	20	-
Reach Compliance Code	unknow	unknow	unknow	unknow	-
ECCN code	EAR99	EAR99	EAR99	EAR99	-
access mode	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	-
Maximum access time	60 ns	60 ns	60 ns	60 ns	-
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-
JESD-30 code	R-PZIP-T20	R-PDIP-T18	R-PDSO-J20	R-PDSO-J20	-
JESD-609 code	e0	e0	e0	e0	-
length	25.8 mm	22 mm	17.15 mm	17.15 mm	-
memory density	4194304 bi	4194304 bi	4194304 bi	4194304 bi	-
Memory IC Type	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	-
memory width	1	1	1	1	-
Number of functions	1	1	1	1	-
Number of ports	1	1	1	1	-
Number of terminals	20	18	20	20	-
word count	4194304 words	4194304 words	4194304 words	4194304 words	-
character code	4000000	4000000	4000000	4000000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	-
organize	4MX1	4MX1	4MX1	4MX1	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	ZIP	DIP	SOJ	SOJ	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	1024	1024	1024	1024	-
Maximum seat height	10.16 mm	4.4 mm	3.75 mm	3.75 mm	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-
surface mount	NO	NO	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	-
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	-
Terminal location	ZIG-ZAG	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	-	7.62 mm	8.89 mm	7.7 mm	-

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