IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | compli |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.012 A |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Maximum supply current (ICC) | 20 mA |
| Prop。Delay @ Nom-Su | 18 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| DM54LS125AW | DM54LS125AJ | |
|---|---|---|
| Description | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) |
| package instruction | DFP, FL14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | compli | unknow |
| Control type | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.012 A | 0.012 A |
| Number of digits | 4 | 4 |
| Number of functions | 1 | 1 |
| Number of terminals | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V |
| Maximum supply current (ICC) | 20 mA | 20 mA |
| Prop。Delay @ Nom-Su | 18 ns | 18 ns |
| Certification status | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | NO |
| technology | TTL | TTL |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |