DM8796J datasheet, PDF - EEWORLD Datasheet

DM8796J: DescriptionIC,ROM,512X8,TTL,DIP,24PIN,CERAMIC; Categorystorage storage; File Size171KB，3 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM8796J Overview

IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	120 ns
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	4096 bi
Memory IC Type	MASK ROM
memory width	8
Number of terminals	24
word count	512 words
character code	512
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.17 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	DM8796J	DM8796N
Description	IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC	IC,ROM,512X8,TTL,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Maximum access time	120 ns	120 ns
JESD-30 code	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0
memory density	4096 bi	4096 bi
Memory IC Type	MASK ROM	MASK ROM
memory width	8	8
Number of terminals	24	24
word count	512 words	512 words
character code	512	512
Maximum operating temperature	70 °C	70 °C
organize	512X8	512X8
Package body material	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	0.17 mA	0.17 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

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