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DM87S185BN/A+

Description
IC,PROM,2KX4,TTL,DIP,18PIN,PLASTIC
Categorystorage    storage   
File Size221KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric

DM87S185BN/A+ Overview

IC,PROM,2KX4,TTL,DIP,18PIN,PLASTIC

DM87S185BN/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP18,.3
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeR-PDIP-T18
JESD-609 codee0
memory density8192 bi
Memory IC TypeOTP ROM
memory width4
Number of terminals18
word count2048 words
character code2000
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX4
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Maximum slew rate0.14 mA
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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