IC 512 X 8 OTPROM, PDIP22, 0.400 INCH, THIN, PLASTIC, DIP-22, Programmable ROM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP22,.4 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 20 ns |
| JESD-30 code | R-PDIP-T22 |
| JESD-609 code | e0 |
| length | 28.105 mm |
| memory density | 4096 bi |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 22 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| DM87SR27BN | DM77SR27BJ | DM87SR27BJ | DM87SR27J | DM87SR27N | DM77SR27J | |
|---|---|---|---|---|---|---|
| Description | IC 512 X 8 OTPROM, PDIP22, 0.400 INCH, THIN, PLASTIC, DIP-22, Programmable ROM | IC 512 X 8 OTPROM, CDIP22, 0.400 INCH, THIN, CERAMIC, DIP-22, Programmable ROM | IC 512 X 8 OTPROM, CDIP22, 0.400 INCH, THIN, CERAMIC, DIP-22, Programmable ROM | IC 512 X 8 OTPROM, CDIP22, 0.400 INCH, THIN, CERAMIC, DIP-22, Programmable ROM | IC 512 X 8 OTPROM, PDIP22, 0.400 INCH, THIN, PLASTIC, DIP-22, Programmable ROM | IC 512 X 8 OTPROM, CDIP22, 0.400 INCH, THIN, CERAMIC, DIP-22, Programmable ROM |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 20 ns | 25 ns | 20 ns | 27 ns | 27 ns | 30 ns |
| JESD-30 code | R-PDIP-T22 | R-GDIP-T22 | R-GDIP-T22 | R-GDIP-T22 | R-PDIP-T22 | R-GDIP-T22 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 22 | 22 | 22 | 22 | 22 | 22 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP22,.4 | DIP22,.4 | DIP22,.4 | DIP22,.4 | DIP22,.4 | DIP22,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.08 mm | 5.715 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
京公网安备 11010802033920号
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