K7P323674C-HC300 datasheet, PDF

Datasheet> All Categories > storage> storage> K7P323674C-HC300

K7P323674C-HC300: DescriptionLate-Write SRAM, 1MX36, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119; Categorystorage storage; File Size450KB，15 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

Download Datasheet Parametric Compare View All

K7P323674C-HC300 Overview

Late-Write SRAM, 1MX36, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119

K7P323674C-HC300 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	BGA, BGA119,7X17,50
Contacts	119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	1.6 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	300 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	37748736 bit
Memory IC Type	LATE-WRITE SRAM
memory width	36
Number of functions	1
Number of terminals	119
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	2.21 mm
Maximum standby current	0.07 A
Minimum standby current	2.37 V
Maximum slew rate	0.62 mA
Maximum supply voltage (Vsup)	2.63 V
Minimum supply voltage (Vsup)	2.37 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	14 mm

Preview

Download Datasheet

View All

K7P323674C

K7P321874C

1Mx36 & 2Mx18 SRAM

36Mb Late Write SRAM Specification

119BGA with Pb & Pb-Free

(RoHS compliant)

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-

lar applications where Product failure could result in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

-1-

Rev. 1.2 February 2007

K7P323674C-HC300 Related Products

	K7P323674C-HC300	K7P321874C-HC250	K7P323674C-GC250	K7P321874C-GC250	K7P321874C-HC300	K7P321874C-GC300	K7P323674C-GC300	K7P323674C-HC250
Description	Late-Write SRAM, 1MX36, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119	Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119	Late-Write SRAM, 1MX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119	Late-Write SRAM, 2MX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119	Late-Write SRAM, 2MX18, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119	Late-Write SRAM, 2MX18, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119	Late-Write SRAM, 1MX36, 1.6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119	Late-Write SRAM, 1MX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119
Is it Rohs certified?	incompatible	incompatible	conform to	conform to	incompatible	conform to	conform to	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-119	BGA, BGA119,7X17,50
Contacts	119	119	119	119	119	119	119	119
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	1.6 ns	2 ns	2 ns	2 ns	1.6 ns	1.6 ns	1.6 ns	2 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY	PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY	PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE, IT CAN ALSO OPERATE AT 2.5V SUPPLY
Maximum clock frequency (fCLK)	300 MHz	250 MHz	250 MHz	250 MHz	300 MHz	300 MHz	300 MHz	250 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
JESD-609 code	e0	e0	e1	e1	e0	e1	e1	e0
length	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
memory density	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit
Memory IC Type	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM
memory width	36	18	36	18	18	18	36	36
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	119	119	119	119	119	119	119	119
word count	1048576 words	2097152 words	1048576 words	2097152 words	2097152 words	2097152 words	1048576 words	1048576 words
character code	1000000	2000000	1000000	2000000	2000000	2000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX36	2MX18	1MX36	2MX18	2MX18	2MX18	1MX36	1MX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	260	260	225	260	260	225
power supply	2.5 V	1.8,2.5 V	1.8,2.5 V	1.8,2.5 V	2.5 V	2.5 V	2.5 V	1.8,2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm	2.21 mm
Maximum standby current	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A	0.07 A
Minimum standby current	2.37 V	1.7 V	1.7 V	1.7 V	2.37 V	2.37 V	2.37 V	1.7 V
Maximum slew rate	0.62 mA	0.5 mA	0.55 mA	0.5 mA	0.57 mA	0.57 mA	0.62 mA	0.55 mA
Maximum supply voltage (Vsup)	2.63 V	1.9 V	1.9 V	1.9 V	2.63 V	2.63 V	2.63 V	1.9 V
Minimum supply voltage (Vsup)	2.37 V	1.7 V	1.7 V	1.7 V	2.37 V	2.37 V	2.37 V	1.7 V
Nominal supply voltage (Vsup)	2.5 V	1.8 V	1.8 V	1.8 V	2.5 V	2.5 V	2.5 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	40	40	30	40	40	30
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	-	1	1	1	1	1	-	-

Recommended Resources

Photoelectric tracking control circuit

PW2211 application circuit diagram

Optocoupler TIL102/TIL103 connection equivalent circuit

Wind speed-frequency conversion circuit

Message controller circuit diagram that uses voice to replace telephone ringtones

Self-excited frequency conversion circuit

Review of the most innovative automotive electronic products in 2009 (1): [b]1. Shorten the visual blind spot The HUD system of the vehicle head-up display [/b][align=center] [/align] [align=center]The HUD system was first used in fighter jets [/align][align=center] When th...; 七月七日晴 Automotive Electronics

Will demand for SiC FETs increase in the future?: Recently, Qorvo mentioned in an article that Yole, an internationally renowned analysis agency, introduced in an earlier report that the SiC market will usher in rapid growth driven by strong demand f...; alan000345 RF/Wirelessly

Show off the prizes. I also received my VISHAY router.: [i=s]This post was last edited by sjtitr on 2014-1-27 09:43[/i] The courier arrived yesterday afternoon. They work at the same pace as us, and they delivered on Sunday. That's pretty cool. I'm so happ...; sjtitr Talking

Voice recognition chip: I want to study voice recognition recently, but I don't know which voice chip is better, especially for non-specific speech recognition. How about Lingyang SPCE061a? Please give me some advice!...; yaschiro Embedded System

MCU clock source problem: I would like to ask the experts in the forum, I use PIC16F1773, and I don't want to connect a crystal or oscillator to the outside, but want the internal clock of the microcontroller, is it feasible? ...; bingol_jxy Microchip MCU

Application of electrolytic capacitors: I would like to ask, can the non-polarized capacitors of CD71 replace the polarized capacitors of CD11? (The voltage and capacity are the same) If anyone has the specification sheet of CD71\CD11 capac...; CAD20008 Discrete Device

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components