®
BAT60J
SMALL SIGNAL SCHOTTKY DIODE
FEATURES AND BENEFITS
s
s
s
s
s
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
EXTREMELY FAST SWITCHING
SURFACE MOUNTED DEVICE
A
60
K
DESCRIPTION
Schottky barrier diode encapsulated in a SOD-323
small SMD package.
This device is intended for use in portable
equipments. It is suited for DC to DC converters,
step-up conversion and power management.
SOD-323
ABSOLUTE RATINGS
(limiting values)
Symbol
V
RRM
I
F
I
FSM
P
tot
T
stg
Tj
TL
* :
Parameter
Repetitive peak reverse voltage
Peak forward current
Surge non repetitive forward current
Power Dissipation
Storage temperature range
Maximum operating junction temperature *
Maximum temperature for soldering during 10s
δ
= 0.11
tp=10ms
Ta=25°C
Value
10
3
5
310
- 65 to +150
150
260
Unit
V
A
A
mW
°C
°C
°C
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth
(
j
−
a
)
THERMAL RESISTANCE
Symbol
R
th (j-a)
Junction to ambient (*)
Parameter
Value
400
Unit
°C/W
(*) Mounted on epoxy board with recommended pad layout.
January 2003 - Ed: 6A
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BAT60J
STATIC ELECTRICAL CHARACTERISTICS
Symbol
V
F
*
Tests Conditions
Forward voltage drop
Tests conditions
Tj = 25°C
I
F
= 10 mA
I
F
= 100 mA
I
F
= 1 A
I
R
**
Reverse leakage current
Tj = 25°C
Tj = 25°C
Tj = 25°C
Tj = 25°C
Tj = 80°C
Pulse test: * tp = 380µs,
δ
< 2%
** tp = 5ms,
δ
< 2%
To evaluate the conduction losses the following equation:
P = 0.38 x I
F(AV)
+ 0.17 I
F2(RMS)
V
R
= 5 V
V
R
= 8 V
V
R
= 10 V
V
R
= 12 V
V
R
= 8 V
Min.
Typ.
0.28
0.35
0.53
1
1.3
2
2.5
73
Max.
0.32
0.40
0.58
3
4
6
7.5
150
µA
Unit
V
2/5
BAT60J
Fig. 1:
Average forward power dissipation versus
average forward current.
Fig. 2-1:
Peak forward current versus ambient
temperature (δ = 0.11).
PF(av)(W)
0.35
δ
= 0.05
δ
= 0.1
δ
= 0.2
δ
= 0.5
IF(A)
3.2
2.8
δ
=1
0.30
0.25
0.20
0.15
2.4
2.0
1.6
1.2
0.10
0.05
IF(av) (A)
0.00
0.0
0.1
0.2
0.3
0.4
0.5
T
0.8
0.4
tp
T
δ
=tp/T
0.6
0.7
0.0
δ
=tp/T
0
25
tp
Tamb(°C)
50
75
100
125
150
Fig. 2-2:
Average forward current versus ambient
temperature (δ = 0.5).
Fig. 3:
Non repetitive surge peak forward current
versus overload duration (maximum values).
IF(av)(A)
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
3.0
2.5
IM(A)
Ta=25°C
2.0
1.5
1.0
T
I
M
Ta=50°C
Ta=75°C
0.5
t
δ
=tp/T
0
25
tp
Tamb(°C)
50
75
100
125
150
δ
=0.5
t(s)
1E-2
1E-1
1E+0
0.0
1E-3
Fig. 4:
Relative variation of thermal impedance junc-
tion to ambient versus pulse duration (Epoxy printed
circuit board FR4 with recommended pad layout).
Fig. 5:
Reverse leackage current versus reverse
voltage applied (typical values).
Zth(j-a)/Rth(j-a)
1E+0
δ
= 0.5
IR(mA)
1E+1
Tj=150°C
δ
= 0.2
δ
= 0.1
1E+0
1E-1
1E-1
Tj=80°C
1E-2
Single pulse
1E-2
t(s)
1E-3
1E-4
1E-3
1E-2
1E-1
1E+0
T
Tj=25°C
1E-3
δ
=tp/T
1E+1
tp
VR(V)
1E-4
0
1
2
3
4
5
6
7
8
9
10
1E+2
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BAT60J
Fig. 6:
Reverse leackage current versus junction
temperature (typical values).
IR[Tj] / IR[Tj=25°C]
1E+5
1E+4
1E+3
1E+2
1E+1
1E+0
Tj(°C)
1E-1
0
25
50
75
100
125
150
10
1
VR(V)
10
VR=8V
Fig. 7:
Junction capacitance versus reverse voltage
applied (typical values).
C(pF)
100
F=1MHz
Tj=25°C
Fig. 8-1:
Forward voltage drop versus forward cur-
rent (High level).
IFM(A)
1E+1
Fig. 8-2:
Forward voltage drop versus forward cur-
rent (Low level).
IFM(A)
1.0
0.9
0.8
Tj=150°C
(Typical values)
Tj=25°C
(Maximum values)
Tj=150°C
(Typical values)
Tj=25°C
(Maximum values)
0.7
0.6
Tj=80°C
(Typical values)
1E+0
0.5
0.4
Tj=80°C
(Typical values)
0.3
0.2
VFM(V)
1E-1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.1
0.0
0.0
0.1
0.2
0.3
0.4
VFM(V)
0.5
0.6
0.7
0.8
Fig. 9:
Thermal resistance junction to ambient ver-
sus copper surface (epoxy printed circuit board FR4,
copper thickness: 35µm).
Rth(j-a) (°C/W)
600
550
500
450
400
350
300
250
200
150
100
0
10
20
30
S(Cu) (mm²)
40
50
60
70
80
90
100
IF=0.75A
4/5
BAT60J
PACKAGE MECHANICAL DATA
SOD-323
DIMENSIONS
H
b
E
A1
REF.
Millimeters
Min.
Max.
1.17
0
0.25
0.1
1.52
1.11
2.3
0.1
0.1
0.1
0.44
0.25
1.8
1.45
2.7
0.46
0.41
0
Inches
Min.
Max.
0.046
0.004
0.017
0.01
0.071
0.057
0.106
0.02
0.016
0.01
0.004
0.06
0.044
0.09
0.004
0.004
A
A1
b
D
A
c
D
E
H
L
c
Q1
L
Q1
MARKING
Type
BAT60JFILM
s
Marking
60
Package
SOD-323
Weight
0.005 g.
Base qty
3000
Delivery mode
Tape & reel
Epoxy meets UL94V-0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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