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DS34T108

Description
Single/Dual/Quad/Octal TDM-over-Packet Chip
File Size273KB,16 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS34T108 Overview

Single/Dual/Quad/Octal TDM-over-Packet Chip

ABRIDGED DATA SHEET
19-4835; Rev 6; 8/09
DS34T101/DS34T102/DS34T104/DS34T108
Single/Dual/Quad/Octal TDM-over-Packet Chip
General Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC
compliant devices allow up to eight E1, T1 or serial
streams or one high-speed E3, T3, STS-1 or serial
stream to be transported transparently over IP, MPLS
or Ethernet networks. Jitter and wander of recovered
clocks conform to G.823/G.824, G.8261, and TDM
specifications. TDM data is transported in up to 64
individually configurable bundles. All standards-
based TDM-over-packet mapping methods are
supported except AAL2. Frame-based serial HDLC
data flows are also supported. With built-in full-
featured E1/T1 framers and LIUs. These ICs
encapsulate the TDM-over-packet solution from
analog E1/T1 signal to Ethernet MII while preserving
options to make use of TDM streams at key
intermediate points. The high level of integration
available with the DS34T10x devices minimizes cost,
board space, and time to market.
Features
Full-Featured IC Includes E1/T1 LIUs and
Framers, TDMoP Engine, and 10/100 MAC
Transport of E1, T1, E3, T3 or STS-1 TDM or
CBR Serial Signals Over Packet Networks
Full Support for These Mapping Methods:
SAToP, CESoPSN, TDMoIP (AAL1), HDLC,
Unstructured, Structured, Structured with CAS
Adaptive Clock Recovery, Common Clock,
External Clock and Loopback Timing Modes
On-Chip TDM Clock Recovery Machines, One
Per Port, Independently Configurable
Clock Recovery Algorithm Handles Network
PDV, Packet Loss, Constant Delay Changes,
Frequency Changes and Other Impairments
64 Independent Bundles/Connections
Multiprotocol Encapsulation Supports IPv4,
IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
VLAN Support According to 802.1p and 802.1Q
10/100 Ethernet MAC Supports MII/RMII/SSMII
Selectable 32-Bit, 16-Bit or SPI Processor Bus
Operates from Only Two Clock Signals, One for
Clock Recovery and One for Packet Processing
Glueless SDRAM Buffer Management
Low-Power 1.8V Core, 3.3V I/O
Applications
TDM Circuit Extension Over PSN
o
Leased-Line Services Over PSN
o
TDM Over GPON/EPON
o
TDM Over Cable
o
TDM Over Wireless
Cellular Backhaul Over PSN
Multiservice Over Unified PSN
HDLC-Based Traffic Transport Over PSN
See detailed feature list in Section
5.
Functional Diagram
CPU
Bus
Ordering Information
PART
DS34T101GN
DS34T101GN+
DS34T102GN
DS34T102GN+
DS34T104GN
DS34T104GN+
DS34T108GN
DS34T108GN+
PORTS TEMP RANGE
1
1
2
2
4
4
8
8
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
-40C to +85C
PIN-PACKAGE
484 TEBGA
484 TEBGA
484 TEBGA
484 TEBGA
484 TEBGA
484 TEBGA
484 HSBGA
484 HSBGA
DS34T108
Octal
E1/T1/J1
Transceiver
Framers
Circuit
Emulation
Engine
10/100
Ethernet
MAC
xMII
E1/T1
Interfaces
BERT
& CAS
LIUs
Buffer
Manager
Clock
Adapters
TDM
Access
SDRAM
Interface
Clock Inputs
+Denotes
a lead(Pb)-free/RoHS-compliant package (explanation).
________________________________________________________
Maxim Integrated Products
1
Some revisions of this device may incorporate deviations from published specifications known as errata.
Multiple revisions of any device may be simultaneously available through various sales channels. For
information about device errata, go to:
www.maxim-ic.com/errata.
For pricing, delivery, and ordering
information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

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