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WS512K32-15G1UI

Description
SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size486KB,13 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WS512K32-15G1UI Overview

SRAM Module, 512KX32, 15ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WS512K32-15G1UI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time15 ns
Other featuresIT CAN ALSO BE CONFIGURED AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length23.88 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.028 A
Minimum standby current2 V
Maximum slew rate0.66 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width23.88 mm
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)
1
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")
square (Package 510) 3.56mm (0.140") height.
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880")
square, 5.08mm (0.200") high (Package 528).
• 68 lead, Hermetic CQFP (G1U) , 23.9mm (0.940")
square (Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint (Fig. 3).
1
WS512K32-XXX
n
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
n
Commercial, Industrial and Military Temperature
Ranges
n
TTL Compatible Inputs and Outputs
n
5 Volt Power Supply
n
Low Power CMOS
n
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940")
square (Package 524) 4.06mm (0.160") height.
n
Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG1UX
1
- 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX
1
- 20 grams typical
WS512K32-XG2LX - 8 grams typical
*15ns Access Time available only in Commercial and Industrial
Temperature. This speed is not fully characterized and is subject to
change without notice.
Note 1: Package Not Recommended For New Design
FIG. 1
PIN CONFIGURATION FOR WS512K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
May 2003, Rev 12
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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