EEWORLDEEWORLDEEWORLD

Part Number

Search

SX16M8200AZF11836

Description
Aluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 16V, 20% +Tol, 20% -Tol, 8200uF, Through Hole Mount, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size69KB,4 Pages
ManufacturerYAGEO
Websitehttp://www.yageo.com/
Environmental Compliance
Download Datasheet Parametric View All

SX16M8200AZF11836 Overview

Aluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 16V, 20% +Tol, 20% -Tol, 8200uF, Through Hole Mount, ROHS COMPLIANT

SX16M8200AZF11836 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerYAGEO
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance8200 µF
Capacitor typeALUMINUM ELECTROLYTIC CAPACITOR
dielectric materialsALUMINUM (WET)
ESR36 mΩ
leakage current1.312 mA
Manufacturer's serial numberSX
Installation featuresTHROUGH HOLE MOUNT
negative tolerance20%
Number of terminals2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package shapeCYLINDRICAL PACKAGE
method of packingTAPE
polarityPOLARIZED
positive tolerance20%
Rated (DC) voltage (URdc)16 V
ripple current3050 mA
surface mountNO
Delta tangent0.14
Terminal shapeWIRE
YAGEO CORPORATION
ALUMINUM ELECTROLYTIC CAPACITORS
SX
[ For Low Impedance & Low E.S.R ]
105°C Single-Ended Lead Aluminum Electrolytic Capacitors For High Frequency Applications
Miniature Size Aluminum
Electrolytic Capacitors
ELECTRICAL CHARACTERISTICS
Operating Temperature : -40° ~ +105°C
Working Voltage : 6.3 ~ 100V
Rate Capacitance Range : 1 ~ 15000µF
Capacitance Tolerance : -20 ~ +20%
DC Leakage Current (µA) : I = 0.01 CV or 3(µA) Whichever is greater.
( Measurements shall be Made After a 2 Minute Charge at Rated Working Voltage )
Dissipation Factor : at 120 Hz, 25°C
WV (V) : 6.3
10
16
25
35
50
63
80
100
D.F (%) : 19
16
14
12
10
8
8
7
7
For capacitor whose capacitance exceeds 1000µF. The value of D.F(%) is increased by 2% for every
addition of 1000µF.
Temperature Characteristics : at 120 Hz
WV (V)
:
Impedance : Z - 40°C / Z + 20°C
Case Dia
Load Life
øD
2000
3000
5000
Multiplier for Ripple Current
Frequency(Hz)
~4.4µF
5.6~33µF
34~330µF
331~1000µF
1200µF higher
50
0.30
0.40
0.60
0.65
0.85
120
0.40
0.50
0.70
0.90
0.90
300
0.50
0.60
0.80
0.90
0.95
1K
0.70
0.80
0.90
0.98
0.98
10K
0.80
0.90
0.95
1.00
1.00
100K
1.00
1.00
1.00
1.00
1.00
6.3
10
10
6
16
5
25
4
35
4
50
4
63
4
100
4
Used in switching regulator applications in com-
puters. Especially for high frequency.
Low impedance and E.S.R., high permissible ripple
current at high frequency and highter operation
temperature (-40°C to +105°C).
High Temperature Load Life at 105°C for 2000 ~
5000 Hours
DESCRIPTION
Load Life : At 105°C Assured with Full Rated Maximum Ripple Current Applied
(a) Capacitance Change : Within 20% of Initial Value
(b) Dissipation Factor : Not Exceed 200% of Initial Requirement
(c) Leakage Current : Not Exceed the Initial Requirement
Shelf Life : 1000 Hours, No Voltage Applied, at 105°C
(a) Capacitance Change : Within 20% of Initial Value
(b) Dissipation Factor : Not Exceed 200 % of Initial Requirement
(c) Leakage Current : Not Exceed 200% of Initial Requirement
DIAGRAM OF DIMENSIONS
4.0
5.0
6.0
8.0
10.0
12.0
13.0
16.0
18.0
22.0
F
1.5
2.0
2.5
3.5
5.0
0.45
0.5
Rubber Stand-off
Vinyl Sleeve
(P.V.C)
Rubber End Seal
Temperature(°C)
Factor
65
1.80
85
1.50
105
1.00
Dimensions : mm
Vinyl Sleeve
(P.V.C)
Rubber End Seal
F 0.5
F 0.5
0.6
L
0.4Max.
15Min.
5Min.
D 0.5
L
15Min.
5Min.
D 0.5
7.5
10.0
0.8
0.8
Embedded System Based on S3C4510B
With the increase of social demand, in order to meet the embedded system's demand for high processing power, real-time multi-tasking, network communication and ultra-low power consumption, more and 32...
frozenviolet Embedded System
Programming problem under EVC, please help!
I am debugging a program written by someone else. I just started using EVC3.0 and there are many errors and I can't debug it. If I want to use part of his original program, which files must be left? I...
ydyzz Embedded System
Device emulator:"Invalid or missing rom image"
I just learned WinCE and want to build a stand-alone development environment. I installed PPC2003 SDK, which comes with three image files: PPC_2003_WWE.bin, PPC_2003_WWE_RADIO.bin, and PPC_2003_WWE_VI...
stronghui Embedded System
Semiconductor Brand Awareness Questionnaire Survey
[size=5][color=#ff0000]Event Details >> [url=https://www.eeworld.com.cn/huodong/201503_questionnaire/]Semiconductor Brand Awareness Questionnaire Survey[/url][/color][/size] [b]Event Time:[/b][color=#...
EEWORLD社区 Integrated technical exchanges
About SDRAM throughput (calculation of bandwidth)?
Is there any specific calculation formula?...
psd0208 FPGA/CPLD
CCC3100 cannot be opened in IAR environment
[align=left][color=#000]Under the IAR environment, the board test program getting_started_with_wlan_station.eww of the CC3100 development kit cannot be opened. What is the situation? Please provide an...
李嘉辉 Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1952  2078  1203  338  2903  40  42  25  7  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号