• Transformer Coupled Across 70 ohms, Measured on Stub:
• BU-63147/157XX-XX0
• BU-63147X3-XX2 (Note 9)
Output Noise, Differential (Direct Coupled)
Output Offset Voltage, Transformer Coupled Across 70 ohms
Rise/Fall Time
• BU-63147/157X3
• BU-63147X4
LOGIC
V
IH
V
IL
I
IH
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
I
IL
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
V
OH
(Vcc=4.75V,I
OH
=max)
V
OL
(Vcc=4.75V,I
OH
=max)
I
OL
I
OH
6
18
20
-250
100
200
7
20
22
150
150
250
9
27
27
10
250
300
300
Vp-p
Vp-p
Vp-p
mVp-p, diff
mVp-p, diff
ns
ns
2.0
20
-100
2.4
0.4
3.4
-3.4
0.8
100
-20
V
V
µA
µA
V
V
mA
mA
POWER SUPPLY REQUIREMENTS
Voltages/Tolerances
• +5V
Current Drain (Total Hybrid)
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
4.75
5.0
80
199
286
455
80
210
308
500
5.25
100
229
348
535
100
240
370
580
V
mA
mA
mA
mA
mA
mA
mA
mA
Data Device Corporation
www.ddc-web.com
3
BU-63147
P-07/12-0
TABLE 1. BU-63147/157 SPECIFICATIONS (CONT.)
PARAMETER
POWER DISSIPATION (NOTE 10)
Total Hybrid
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
Hottest Die
BU-63147/157/XX-XX0
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
THERMAL
• Thermal Resistance, Junction-to-Case, Hottest Die (θ
JC
)
• Operating Junction Temperature
• Storage Temperature
• Lead Temperature (soldering, 10 sec.)
PHYSICAL CHARACTERISTICS
Size
36-Pin DIP
36-Lead Flat pack
Weight
MIN
TYP
MAX
UNITS
0.4
0.65
0.73
0.88
0.4
0.7
0.84
1.1
0.2
0.43
0.59
0.78
0.2
0.48
0.7
1.00
0.5
0.8
1.04
1.28
0.5
0.85
1.15
1.50
0.25
0.6
0.84
1.13
0.25
0.65
0.95
1.35
12
150
150
+300
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
°C/W
°C
°C
°C
-55
-65
1.900 x .800 x .205
(48.26 x 20.32 x 5.21)
1.900 x .800 x .200
(48.26 x 20.32 x 5.08)
0.6
(17)
in.
(mm)
in.
(mm)
oz
(g)
Notes:
Notes 1 through 6 are applicable to the Receiver Differential Resistance and Differential Capacitance specifications:
(1) Specifications include both transmitter and receiver (assumed tied together externally).
(2) Impedance parameters are specified directly between pins TX/RX A(B) and TX/RX A(B) hybrid.
(3) It is assumed that all power and ground inputs to the hybrid are connected and that the hybrid case is connected to ground for the impedance measurement.
(4) The specifications are applicable for both unpowered and powered conditions.
(5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz.
(6) Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested.
(7) The Threshold Level, as referred to in this specification, is meant to be the maximum peak-to-peak voltage (measured on the data bus) that can be applied to the
receiver's input without causing the output to change from the OFF state.
(8) Assumes a common mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer
coupled), and referenced to transceiver ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum
CMRR.
(9) MIL-STD-1760 requires minimum output voltage of 20 Vp-p on the stub connection. The -XX2 option is
not
available for the BU-63147X4 or BU-63157 versions.
(10) Power dissipation specifications assume a transformer coupled configuration, with external dissipation (while transmitting) of 0.14 watts for the active isolation trans-
former, 0.08 watts for the active coupling transformer, 0.45 watts for each of the two bus isolation resistors, and 0.15 watts for each of the two bus termination resistors.
(11) Assuming the use of isolation transformers with the turns ratios shown in Figure 3 and in the absence of common mode signal on the 1553 stub, this equates to a
nominal stub voltage of 38 Volts
PK-to-PK
transformer-coupled, or 53 Volts
PK-to-PK
direct-coupled.
Data Device Corporation
www.ddc-web.com
4
BU-63147
P-07/12-0
TABLE 2. BU-63157 RADIATION SPECIFICATIONS*
PART NUMBER
BU-63157X3
TOTAL DOSE
100 KRAD
SINGLE EVENT
LATCHUP
IMMUNE
INTRODUCTION
The BU-63147/157 is a dual redundant transmitter and receiver
packaged in a 36-pin DDIP or flat pack. It is directly compatible to
Harris 15530 encoder/decoder and has internal (factory preset)
threshold levels. The dual transceiver only requires +5V power
and conforms to MIL-STD-1553A and 1553B. For McAir compat-
ibility, versions are available with rise/fall times of 200 to 300
nsec.
Figure 3 illustrates the connection between a BU-63147/157
transceiver and a MIL-STD-1553 Data Bus. After transformer
isolating the transceiver, it can be either direct coupled (short
stub) or transformer coupled (long stub) to the Data Bus.
*Note: Radiation parameters specified on this data sheet are derived from initial
qualification testing by DDC and published data from ASIC manufacturers. These
devices have not been evaluated for compliance to the RHA requirements stipu-
lated in MIL-PRF-38534, Appendix G.
TABLE 3. HIGH RELIABILITY SCREENING OPTIONS
FOR BU-63157
ELEMENT EVALUATION
Visual Inspection:
Integrated Circuits
Transistor & Diodes
Passive Components
METHOD
TRANSMIT OPERATING MODE
MIL-STD-883, Method 2010 Condition A
MIL-STD-750, Method 2072 and 2073
MIL-STD-883, Method 2032 Class S
SEM Analysis for Integrated MIL-STD-883, Method 2018
Circuits
Element Evaluation:
Visual, Electrical, Wire
Bondability, 24-Hour
Stabilization Bake, 10
Temperature Cycles,
5000 g’s constant accelera-
tion, 240-Hour Powered
Burn-In and 1000-Hour Life
Test (Burn-In and 1000-
Hour Life Test are Only
Required for Active
Components.)
ASSEMBLY & TEST
Particle Impact Noise
Detection (PIND)
320-Hour Burn-In
(Standard on this device)
100% Non-Destructive
Wirebond Pull
(Standard on this device)
Radiographic (X-Ray)
Analysis
QCI TESTING
Extended Temperature
Cycling:
20 Cycles Including
Radiographic (X-Ray)
Testing
Moisture Content Limit of
5000 PPM
MIL-STD-883, Method 2020
Condition A
MIL-STD-883, Method 1015
The transmitter section accepts encoded TTL data and converts
it to phase-modulated bipolar form using a waveshaping network
and driver circuits. The driver outputs TX DATA OUT and TX DATA
OUT are transformer coupled to the Data Bus.
The transmitter output terminals can be put into a high imped-
ance state by setting INHIBIT high, or setting TX DATA IN and TX
DATA IN to the same logic level. The operating modes are shown
in TABLE 4.
The transceivers are able to operate in a “wraparound” mode.
This allows output data to be monitored by the receiver section
and returned to the decoder where it is checked for errors.
MIL-PRF-38534
TABLE 4. TRANSMIT OPERATING MODE
TX DATA IN
X
0
0
MIL-STD-883, Method 2023
1
1
MIL-STD-883, Method 2012
TX DATA IN
X
0
1
0
1
TX INHIBIT
H
X
L
L
X
DRIVER OUTPUT
OFF (NOTE)
OFF
TX DATA OUT ON,
TX DATA OUT OFF
TX DATA OUT ON,
TX DATA OUT OFF
OFF
NOTE: DRIVER OUTPUT terminals are in the high impedance mode during
Question 14 : 1. Figure (06) is a typical application circuit in the UC1525A manual. Transformer T1 has two secondary windings, which are used to drive a half-bridge circuit. If a full-bridge circuit...
1. Project PurposeIn order to promote everyone's determination and courage to learn electronics, and to guide beginners to a cheaper and more hands-on and practical learning path.Use the cheapest tool...
Recently, the first Digital China Summit was held in Fuzhou, attracting many domestic ICT industry giants to participate in the exhibition. The long queues outside the venue, the noisy and exciting...[Details]
In the past few days, the news that ZTE was "banned" by the US Department of Commerce has triggered widespread reflection and concern in various domestic industries about the lack of independent co...[Details]
The Sino-US trade war has already started. Trump's series of actions have had a negative impact on the global economy, such as increasing tariffs on Chinese companies and restricting domestic compa...[Details]
In the war without gunpowder between China and the United States,
ZTE
has become a new victim. The seven-year chip ban by the United States has pushed this communications giant to a life-or...[Details]
"Originally, there are many people who can design very good
chips
, but the market does not give domestic
chips
the opportunity to iterate, and domestic companies cannot give engine...[Details]
In the actual project development process, hardware circuits often need to be modified, and the modified parts need to modify the driver. Thinking about the coming and going of such requirements is t...[Details]
In simple terms, high-end chips solve many complex problems, mid-range chips solve a single complex problem, and low-end chips solve a simple problem. Let's learn more about the relevant content wi...[Details]
stm32cubeMX graphical configuration content STM32CubeMX is part of the original STMCube initiative from st microelectronics, and STM32Cube includes STM32CubeMX. STM32CubeMX is a graphical software co...[Details]
LAN8720 configuration: IP: 192.168.192.30 Gateway: 192.168.192.1 A high frequency of ARP packets is detected The content of the packet asks for the mac address of 192.168.192.1, and asks the resp...[Details]
LAN8720 test code arrangement 1. Modified based on two projects, namely "Experiment 55 Network Communication Experiment" of Zhengdian Atom ATK and "STSW-STM32070" routine of ST official The hardware ...[Details]
Function List and Notes (lower-level driver part) 1. IO port initialization: control IO and communication IO. Control includes power control, reset and low power mode. Communication is the serial po...[Details]
China Energy Storage Network News:
The State Grid Corporation of China, this elephant, is planning to turn around and enter the emerging power service market.
The rallying cry for the tr...[Details]
As many companies listed with
the concept of
touch screen
begin to "transform and upgrade", the official voice of the TP industry is getting smaller and smaller. At the same time, the list o...[Details]
Since China began to try to produce panels independently in 1998, in 2018, China's panel industry has gradually upgraded from a marginal industry to the largest production scale. Especially in the ...[Details]
The F1 racetrack is roaring with engines, and a fierce F1 race is about to begin. I am not a fan of racing cars, and I have nothing to do with this world, but
I spent a special day here
because...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
