MGS153-673GG datasheet, PDF - EEWORLD Datasheet

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MGS153-673GG: DescriptionIC Socket, BGA553, 153 Contact(s); CategoryThe connector socket; File Size128KB，1 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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MGS153-673GG Overview

IC Socket, BGA553, 153 Contact(s)

MGS153-673GG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	STANDARD: UL 94V-0
Contact to complete cooperation	GOLD OVER NICKEL
Contact completed and terminated	GOLD OVER NICKEL
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	BGA553
Shell material	POLYETHYLENE
JESD-609 code	e4
Manufacturer's serial number	MGS
Number of contacts	153

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Ball Grid Array

(BGA) Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

BGA Sockets

Standard Socket (S):

• Mates with Standard Adapter (A)

• Socket size same size as BGA device body

• Use with SMT Adapter for LGA and reworked

BGA device socketing

Extraction Socket (SB):

• Mates with Extraction Slot Adapter (AX)

• Socket size equals BGA body + .079/(2.0)

• Protects valuable PCB during device/adapter

extraction - tool never touches PCB

• Available in 1.0, 1.27 and 1.5mm pitch only

Features:

• Advanced

exclusive eutectic solder ball

terminals offer superior SMT processing.

• Uses same footprint as BGA device.

• Proven long-term performance in vigorous

temperature cycling applications - solder

ball terminal absorbs TCE mismatch.

• Closed bottom socket terminal for 100%

anti-wicking of solder.

• Gold contacts allow gold/gold

interconnections to male Adapter pins.

• Low insertion force socket with multi-

fingered high reliability Beryllium Copper

contacts.

• Coplanarity consistently under .006 inch

industry standard.

• In-house Tape and Reel packaging

available.

• See page 4 for How It Works.

Guide Post Socket (SG):

• Integral molded corners allow accurate positioning of

device/adapter assembly in blind-mating applications.

• Mates with Extraction Slot Adapter (AX)

• Socket size equals BGA body + .276/(7.00)

• Available in 1.27 and 1.5mm pitch only

Terminals:

1.27 & 1.5mm Pitch Terminals

Type -636

Type -673

Solder Ball

STANDARD

.117

(2.97)

1.0mm Pitch Terminals

Type -716

Type -717

Solder Ball

.105

(2.67)

.090

(2.29)

Thru-Hole

.090

(2.29)

.125

(3.18)

.024/(0.61) Dia.

PATENTED

.015 Dia.

(0.38)

Thru-Hole

.117

(2.97)

.095

(2.41)

.030 Dia.

(0.76)

.128

(3.25)

.018 Dia.

(0.46)

.105

(2.67)

PATENTED

Terminals and Contacts:

Terminals: Brass - Copper Alloy (C36000)

ASTM-B-16

Contacts: Beryllium Copper - Copper

Alloy (C17200), ASTM-B-194

0.80mm Pitch Terminals

Type -731

Type -702

Solder Ball

Thru-Hole

0.75mm Pitch Terminals

Type -758

Solder Ball

.125

(3.18)

.125

(3.18)

.080

(2.03)

.011 Dia.

(0.28)

.125

(3.18)

.020/(0.51) Dia.

.018/(0.46) Dia.

PATENTED

Plating:

G - Gold over Nickel

PATENTED

Body Material:

M - Molded High Temp. Glass Filled

Thermoplastic (P.P.S.), U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

F - FR-4 Glass Epoxy, U.L. Rated 94V-O

Footprint Dash#

If Applicable

How To Order

XXX -636

Contact Plating

G - Gold

Terminal Plating

G - Gold

Terminal Type

Number of Positions

See BGA Footprint section or web site

Model Type

= Standard Socket

= Extraction Slot (1.5, 1.27 and 1.0mm pitch only)

= Guide Post Socket (1.5 and 1.27mm pitch only)

Solder:

63Sn/37Pb, Eutectic, 183˚C (361.4˚F)

Body Type

M - Molded PPS (1.27 & 1.5mm pitch)

F - FR-4 (0.75, 0.80 & 1.0mm pitch)

Pitch

B = .059/(1.5mm)

G = .050/(1.27mm)

H = .039/(1.0mm)

J = .0315/(0.80mm)

K = .0295/(0.75mm)

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 5

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