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PC755BVGS366LE

Description
RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, CGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,64 Pages
Manufacturere2v technologies
Download Datasheet Parametric Compare View All

PC755BVGS366LE Overview

RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, CGA-360

PC755BVGS366LE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Makere2v technologies
package instructionBGA, CGA360,19X19,50
Reach Compliance Codecompli
ECCN code3A001.A.3
Other featuresSEATED HGT-NOM
Address bus width32
bit size32
boundary scanYES
maximum clock frequency100 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
length25 mm
low power modeYES
Number of terminals360
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Encapsulate equivalent codeCGA360,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
power supply2,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height4.08 mm
speed366 MHz
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
 
PC755/745
PowerPC 755/745 RISC Microprocessor
Datasheet DS0828
FEATURES
18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz (PC755)
15.7SPECint95, 9SPECfp95 at 350 MHz (PC745)
733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz 
(PC745)
Selectable Bus Clock (12 CPU Bus Dividers up to 10x)
P
D
 
Typical 5.4W at 400 MHz, Full Operating Conditions
Nap, Doze and Sleep Modes for Power Savings
Superscalar (3 Instructions per Clock Cycle) Two Instruction + 
Branch
4 Beta Byte Virtual Memory, 4‐GByte of Physical Memory
64‐bit Data and 32‐bit Address Bus Interface
32‐KB Instruction and Data Cache
Six Independent Execution Units
Write‐back and Write‐through Operations
f
INT
 
max = 400 MHz 
f
BUS
 
max = 100 MHz
Voltage I/O 2.5V/3.3V; Voltage Int 2.0V
This document describes pertinent physical characteristics
of the PC755. For information on specific PC755 part
numbers covered by this or other specifications, see Section
”Table 11‐1 provides the e2v part numbering nomenclature
for the PC755 and PC745 devices fully addressed by this
document.” on page 59. For functional characteristics of the
processor, refer to the MPC750 RISC Microprocessor Family
User’s Manual.
To locate any published errata or updates for this docu‐
ment, refer to the website listed on the back cover of this
document.
Screening
This product is manufactured in full compliance with:
HiTCE CBGA According to e2v Standards
CBGA + CI‐CGA + FC‐PBGA up Screenings Based upon e2v 
Standards
Full Military Temperature Ranges (T
C
 = ‐55°C, T
J
 = +125°C)
Industrial Temperature Ranges (T
C
 = ‐40°C, T
J
 = +110°C)
Commercial Temperature ranges (T
C
 = 0°C, T
J
 = +105°C)
Description
This document is primarily concerned with the PC755; however,
unless otherwise noted, all information here also applies to the
PC745. The PC755 and PC745 are reduced instruction set com‐
puting (RISC) microprocessors that implement the PowerPC
instruction set architecture.
Whilst e2v technologies has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for the consequences of any
use thereof and also reserves the right to change the specification of goods without notice. e2v technologies accepts no liability beyond the set out in its
standard  conditions  of  sale  in  respect  of  infringement  of  third  party  patents  arising  from  the  use  of  devices  in  accordance  with  information  contained
herein.
e2v technologies (uk) limited, Waterhouse Lane, Chelmsford, Essex CM1 2QU United Kingdom   Holding Company: e2v technologies plc
Telephone: +44 (0)1245 493493   Facsimile: +44 (0)1245 492492
Contact e2v by e‐mail: enquiries@e2v.com or visit www.e2v.com for global sales and operations centres.
© e2v technologies (uk) limited 2016
0828M–HIREL–02/16

PC755BVGS366LE Related Products

PC755BVGS366LE PC755CCSHU366LE PC755BCSHU366LE PC755BCPHU366LE PC755BCGHU366LE
Description RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, CGA-360 RISC Microprocessor, 366MHz, CMOS, CBGA360, BGA-360 RISC Microprocessor, 366MHz, CMOS, CBGA360, BGA-360 RISC Microprocessor, 366MHz, CMOS, CBGA360, BGA-360 RISC Microprocessor, 366MHz, CMOS, CBGA360, BGA-360
package instruction BGA, CGA360,19X19,50 BGA, BGA, BGA, BGA,
Reach Compliance Code compli compliant compliant compliant compliant
Address bus width 32 32 32 32 32
boundary scan YES YES YES YES YES
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
External data bus width 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES
JESD-30 code S-CBGA-B360 S-CBGA-B360 S-CBGA-B360 S-CBGA-B360 S-CBGA-B360
length 25 mm 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES YES
Number of terminals 360 360 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Maximum seat height 4.08 mm 2.8 mm 2.8 mm 3.24 mm 3.24 mm
speed 366 MHz 366 MHz 366 MHz 366 MHz 366 MHz
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches - 1 1 1 1

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