64X4 NON-VOLATILE SRAM, 200ns, PDIP18, DIP-18
| Parameter Name | Attribute value |
| Maker | Seiko Epson Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 18 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-PDIP-T18 |
| length | 22 mm |
| memory density | 256 bi |
| Memory IC Type | NON-VOLATILE SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 18 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64X4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| S-22H10I10 | S-22H12IF10 | S-22H12I10 | S-22S12IF10 | S-22S12I10 | S-22S10IF10 | S-22H10IF10 | |
|---|---|---|---|---|---|---|---|
| Description | 64X4 NON-VOLATILE SRAM, 200ns, PDIP18, DIP-18 | 256X4 NON-VOLATILE SRAM, 200ns, PDSO18, SOP-18 | 256X4 NON-VOLATILE SRAM, 200ns, PDIP18, DIP-18 | 256X4 NON-VOLATILE SRAM, 200ns, PDSO18, SOP-18 | 256X4 NON-VOLATILE SRAM, 200ns, PDIP18, DIP-18 | 64X4 NON-VOLATILE SRAM, 200ns, PDSO18, SOP-18 | 64X4 NON-VOLATILE SRAM, 200ns, PDSO18, SOP-18 |
| Maker | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
| Parts packaging code | DIP | SOIC | DIP | SOIC | DIP | SOIC | SOIC |
| package instruction | DIP, | SOP, | DIP, | SOP, | DIP, | SOP, | SOP, |
| Contacts | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| JESD-30 code | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G18 |
| length | 22 mm | 11.4 mm | 22 mm | 11.4 mm | 22 mm | 11.4 mm | 11.4 mm |
| memory density | 256 bi | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 256 bit | 256 bit |
| Memory IC Type | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| word count | 64 words | 256 words | 256 words | 256 words | 256 words | 64 words | 64 words |
| character code | 64 | 256 | 256 | 256 | 256 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 64X4 | 256X4 | 256X4 | 256X4 | 256X4 | 64X4 | 64X4 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | SOP | DIP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 2 mm | 5.08 mm | 2 mm | 5.08 mm | 2 mm | 2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 5.4 mm | 7.62 mm | 5.4 mm | 7.62 mm | 5.4 mm | 5.4 mm |