Product Guide
F_1105W Series, Dome Lens Type AlInGaP SMT LED
s
Features
• High brightness AllnGaP die material
• Dome lens provides intensified narrow, bright beam
• Available for both standard and reverse mounting
• Wider operating temperature: -40° ~ +100°C
s
Applications
• High-beam indicator for automotive use
• Backlighting for automotive dashboards
• Indoor / outdoor full-color signboards
s
Outline Dimensions
s
Recommended Solder Pad
at Surface Mount
1.55
0.6
1.6
0.3
Anode
s
Recommended Solder Pad
at reverse mount
1.6
1.5
HOLE
(1.6)
0.5
0.5
R0.8
0.6
Cathode Mark
Polarity Mark
Cathode
PCB
2.3+0.05
Unit: mm
Tolerance + 0.1
s
Electro-Optical Characteristics
Part No.
Material Emitted Lens
Color Color
AlInGaP
AlInGaP
AlInGaP
Red
Orange
Yellow
(Ta=25°C)
Wavelength
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Luminous
Intensity
IV
MIN.
TYP.
I
F
Forward
Voltage
V
TYP.
MAX.
F
Reverse Viewing
Current
IR
Angle
I
F
MAX.
V
R
(2
θ
1/2)
FR1105W
FA1105W
FY1105W
70 180 20
Water
70 200 20
Clear
70 180 20
mcd
mA
635
609
592
626
605
590
nm
15
15
15
20
20
20
mA
1.9
1.9
1.9
V
2.4
2.4
2.4
20
20
20
mA
100
100
100
µA
5
5
5
V
Deg.
50°
Units
1.5
2.1 + 0.05
(4.6)
3.2
1.6
(2)
s
Absolute Maximum Ratings
Red-Orange
Orange-Red
FA
81
30
100
5
-40 to +100
-40 to +120
1.0 (DC) 3.33 (Pulse)
Amber
FY
81
30
100
5
(Ta=25°C)
Item
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Symbol
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
FR
81
30
100
5
Units
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
1.75 + 0.1
4+0.1
φ
1.5
+0.1
0
(1.8)
(0.25)
for Reverse
Mount Type
s
Taping Specifications
φ
1.5
+0.1
0
(1.85)
1.75+0.1
4+0.1
(0.25)
Center
Hole
8+0.2
for Standard
Mount Type
Quantity on tape:
2000 pieces
per reel
(0.5)
(2.2)
(
φ
1.1)
2+ 0.05
4+0.1
3.5 +0.05
8+0.2
(
φ
1.1)
2+0.05
4+0.1
3.5+0.05
(2.1)
Quantity on tape:
2000 pieces
per reel
2+0.5
φ
21+0.8
Center
Hole
Cathode
Center
Hole
(3.45)
(3.5)
φ
13+0.2
Direction to pull
RR
Cathode
+1
φ
60 -0
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Operation Current Derating Chart (DC)
Direction to pull
TR
s
Precautions
FR, FA, FY
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
(X & Y)
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1105W-0301
~
0
60 to 120 sec.
5 sec. max
FR, FA, FY
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
