FS1AB-FS1MB
Surface Mount Rectifiers
REVERSE VOLTAGE: 50 --- 1000 V
CURRENT:
1.0A
Features
Plastic package has
underwriters laborator
flammability classification
94V-0
For surface mounted applications
Low profile package
Built-in strain relief,ideal for automated placement
Glass passivated chip junction
111
DO - 214AA(SMB)
4.7± 0.25
2.0± 0.15
5.4± 0.2
Mechanical Data
11
Case:JEDEC DO-214AA,molded plastic over
11passivated
chip
Polarity: color band denotes cathode end
Weight: 0.003 ounces, 0.093 gram
2.3± 0.15
11
High temperature soldering:
1
250
o
C/10 seconds at terminals
1.3± 0.2
0.203MAX
Dimensions in millimeters
Ratings at 25
o
C ambient temperature unless otherwise specified
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
FS1AB FS1BB FS1DB FS1GB FS1JB FS1KB FS1MB UNITS
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forw ord rectified current
c
@
T
L
=90
O
C
Peak forward surge current 8.3ms single
c
half-sine-wave superimposed on rated
c
load
Maximum instantaneous forw ard voltage at
1.0A
Maximum DC reverse current
@T
A
=25
o
C
o
V
RRM
V
RWS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
R
JA
JL
50
35
50
100
70
100
200
140
200
400
280
400
1.0
30.0
1.30
5.0
50.0
600
420
600
800
560
800
3.6± 0.3
0.2± 0.05
1000
700
1000
V
V
V
A
A
V
A
250
500
7.0
o
at rated DC blocking voltage @T
A
=125 C
Maximum reverse recovery time (NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resitance (NOTE 3)
150
10
105
32
- 55 ------ + 150
ns
pF
C/W
o
Operating junction and storage temperature range
T
J
T
STG
NOTE: 1.Rev erse recov ery time test conditions:I
F
=0.5A,I
R
=1.0A,I
rr
=0.25A
2. Measured at 1.0MHz and applied rev erse v oltage of 4.0 Volts
C
3. Thermal resistance f rom junction to ambient and junction to lead P.C.B.mounted on 0.2''X0.2''(5.0X5.0mm
2
) copper pad areas
http://www.luguang.cn
mail:lge@luguang.cn
FS1AB-FS1MB
Ratings AND Charactieristic Curves
Fig. 1 — Forward Current
Derating Curve
1.2
50
Resistive or Inductive Load
Surface Mount Rectifiers
Fig. 2 — Maximum Non-Repetitive
Peak Forward Surge Current
Peak Forward Surge Current (A)
T
L
= 90°C
8.3ms Single Half Sine-Wave
(JEDEC Method)
Average Forward Rectified Current (A)
1.0
40
30
0.5
20
10
P.C.B. Mounted on 0.2 x 0.2" (5.0 x 5.0 mm)
Copper Pad Areas
0
0
20
40
60
80
100
120
140
160
180
0
1
10
100
Lead Temperature (°C)
Number of Cycles at 60 H
Z
Fig. 3 — Typical Instantaneous
Forward Characteristics
30
30
Fig. 4 — Typical Reverse
Characteristics
Instantaneous Reverse Current (µA)
10
Instantaneous Forward Current (A)
10
T
J
= 125°C
T
J
= 125°C
1
T
J
= 25°C
0.1
Pulse Width = 300µs
1% Duty Cycle
1
T
J
= 100°C
0.1
T
J
= 25°C
0.01
0
20
40
60
80
100
0.01
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 — Typical Junction
Capacitance
30
100
Fig. 6 — Typical Transient
Thermal Impedance
Transient Thermal Impedance (°CW)
Mounted on 0.2 x 0.2" (5 x 5mm)
Copper Pad Area
Junction Capacitance (pF)
T
J
= 25°C
f = 1.0MH
Z
Vsig = 50mVp-p
10
10
1
1
10
100
1
0.01
0.1
1
10
Reverse Voltage (V)
t, Pulse Duration (sec.)
http://www.luguang.cn
mail:lge@luguang.cn
PCB Design
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