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FSMD020-1206

Description
Surface Mount PTC FSMD1206 Series
File Size98KB,4 Pages
ManufacturerETC1
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FSMD020-1206 Overview

Surface Mount PTC FSMD1206 Series

Surface Mount PTC
FSMD1206 Series
Lead Free Component
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current:
50mA~1.5A
Maximum Voltage:
6V~60V
Temperature Range:
-40℃ to 85℃
Agency Recognition: Pending
Electrical Characteristics(23℃)
Part
Number
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
Hold
Trip
Current Current
I
H
,
A
0.05
0.10
0.20
0.35
0.50
0.75
1.00
1.50
Rated
Voltage
V
MAX
,
Vdc
60
60
30
16
8
6
6
6
Max
Typical Max Time to Trip
Current Power
Current Time
I
MAX
, A
10
10
10
40
40
40
40
40
Resistance
Tolerance
R
MIN
R1
MAX
Ω
3.60
1.60
0.60
0.30
0.15
0.10
0.055
0.040
I
T
,
A
0.15
0.25
0.40
0.75
1.00
1.50
1.80
3.00
Pd
,
W
0.4
0.4
0.4
0.4
0.4
0.6
0.6
0.8
A
0.25
0.50
8.00
8.00
8.00
8.00
8.00
8.00
Sec
1.50
1.00
0.05
0.10
0.10
0.20
0.30
1.00
Ω
50.00
15.00
2.50
1.20
0.70
0.29
0.210
0.120
I
H
=Hold current-maximum current at which the device will not trip at 23℃still air.
I
T
=Trip current-minimum current at which the device will always trip at 23
still air.
V
MAX
=Maximum voltage device can withstand without damage at it rated current.(I max)
I
MAX
= Maximum fault current device can withstand without damage at rat ed voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23
still air environment.
R
MIN
=Minimum device resistance at 23℃ prior to tripping.
R
1
MAX
=Maximum device resistance at 23℃ measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
NOTE : All Specification subject to change without notice
.
49
PDF created with FinePrint pdfFactory trial version
http://www.pdffactory.com

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