Surface Mount PTC
FSMD1206 Series
※
Lead Free Component
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current:
50mA~1.5A
Maximum Voltage:
6V~60V
Temperature Range:
-40℃ to 85℃
Agency Recognition: Pending
Electrical Characteristics(23℃)
Part
Number
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
Hold
Trip
Current Current
I
H
,
A
0.05
0.10
0.20
0.35
0.50
0.75
1.00
1.50
Rated
Voltage
V
MAX
,
Vdc
60
60
30
16
8
6
6
6
Max
Typical Max Time to Trip
Current Power
Current Time
I
MAX
, A
10
10
10
40
40
40
40
40
Resistance
Tolerance
R
MIN
R1
MAX
Ω
3.60
1.60
0.60
0.30
0.15
0.10
0.055
0.040
I
T
,
A
0.15
0.25
0.40
0.75
1.00
1.50
1.80
3.00
Pd
,
W
0.4
0.4
0.4
0.4
0.4
0.6
0.6
0.8
A
0.25
0.50
8.00
8.00
8.00
8.00
8.00
8.00
Sec
1.50
1.00
0.05
0.10
0.10
0.20
0.30
1.00
Ω
50.00
15.00
2.50
1.20
0.70
0.29
0.210
0.120
I
H
=Hold current-maximum current at which the device will not trip at 23℃still air.
I
T
=Trip current-minimum current at which the device will always trip at 23
℃
still air.
V
MAX
=Maximum voltage device can withstand without damage at it rated current.(I max)
I
MAX
= Maximum fault current device can withstand without damage at rat ed voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23
℃
still air environment.
R
MIN
=Minimum device resistance at 23℃ prior to tripping.
R
1
MAX
=Maximum device resistance at 23℃ measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
NOTE : All Specification subject to change without notice
.
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Surface Mount PTC
FSMD1206 Series
FSMD Product Dimensions (Millimeters)
Part
Number
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
A
Min
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
Max
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
Min
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
B
Max
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
Min
0.45
0.45
0.45
0.45
0.25
0.45
0.75
0.80
C
Max
0.75
0.75
0.75
0.75
0.55
1.25
1.25
1.80
D
Min
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Thermal Derating Curve
Thermal Derating Curve, FSMD1206 Series
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
NOTE : All Specification subject to change without notice
.
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Surface Mount PTC
FSMD1206 Series
Typical Time-To-Trip at 23℃
Z =FSMD005-1206
A =FSMD010-1206
B =FSMD020-1206
C =FSMD035-1206
D =FSMD050-1206
E =FSMD075-1206
F =FSMD100-1206
G =FSMD150-1206
A
100
10
Time-to-trip (S)
1
0.1
B
C
D
E F
G
Z
0.01
0.001
0.1
1
Fault current (A)
10
100
Part Numbering System
FSMD
Part Marking System
F
□ □ □
Current rating
□
Part Identification
Fuzetec Logo
FA
Example
FZ
=FSMD005-1206
FA
=FSMD010-1206
FB
=FSMD020-1206
FC
=FSMD035-1206
FD
=FSMD050-1206
FE
=FSMD075-1206
FF
=FSMD100-1206
FG=FSMD150-1206
Standard Package
P/N
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
Pcs /Bag
--------
--------
--------
--------
Reel/Tape
4K
4K
4K
4K
P/N
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
Pcs /Bag
--------
--------
--------
--------
Reel/Tape
4K
4K
4K
4K
Warning:
-Operation
beyond the specified maximum ratings or improper use may result in damage and possible electrical
arcing and/or flame.
-PPTC device are intended for occasional o vercurrent protection. Application for repeated overcurrent condition
and/or prolonged trip are not anticipated.
-Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.
NOTE : All Specification subject to change without notice
.
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Surface Mount PTC
FSMD1206 Series
Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
Pad dimensions(millimeters)
A
B
Device
Nominal
Nominal
FSMD005-1206
2.00
1.00
FSMD010-1206
2.00
1.00
FSMD020-1206
2.00
1.00
FSMD035-1206
2.00
1.00
FSMD050-1206
2.00
1.00
FSMD075-1206
2.00
1.00
FSMD100-1206
2.00
1.00
FSMD150-1206
2.00
1.00
Solder reflow
C
Nominal
1.90
1.90
1.90
1.90
1.90
1.90
1.90
1.90
※
Due to
“Lead
Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause damage to
other components.
1. Recommended reflow methods; IR , vapor phase oven,
hot air oven.
2. The FSMD1206 Series are suitable for use with
wave-solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned using standard industry
methods and solvents.
CAUTION:
If reflow temperatures exceed the recommended
Profile, devices may not meet the performance
requirements.
Rework:
Use standard industry practices.
NOTE : All Specification subject to change without notice
.
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