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FXLC95000CLR1

Description
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA24
Categorysemiconductor    The embedded processor and controller   
File Size562KB,38 Pages
ManufacturerFREESCALE (NXP)
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FXLC95000CLR1 Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA24

FXLC95000CLR1 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals24
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage1.89 V
Minimum supply/operating voltage1.71 V
Rated supply voltage1.8 V
Processing package description3 X 5 MM, 1 MM HEIGHT, LGA-24
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, THIN PROFILE, FINE PITCH
surface mountYes
Terminal formBUTT
Terminal spacing0.5000 mm
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
Microprocessor typeMICROPROCESSOR CIRCUIT
Freescale Semiconductor, Inc.
Data Sheet: Technical Data
FXLC95000CL
Rev 1.2, 8/2013
Xtrinsic FXLC95000CL Intelligent,
Motion-Sensing Platform
The FXLC95000CL Intelligent, Motion-Sensing Platform is a
breakthrough device with the integration of a 3-axis MEMS
accelerometer and a 32-bit ColdFire MCU that enables
autonomous, high-precision sensing solutions with local
computing and sensors management capability in an open, easy
to use, architecture.
The FXLC95000CL hardware is user-programmable to create an
intelligent high-precision, flexible, motion-sensing platform. The
user's firmware, together with the hardware device, can make
system-level decisions required for sophisticated applications,
such as gesture recognition, pedometer, and e-compass tilt
compensation and calibration.
The FXLC95000 platform can act as an intelligent sensing hub
and a highly configurable decision engine. Using the Master I
2
C
or SPI module, the FXLC95000 platform can manage secondary
sensors such as pressure sensors, magnetometers, and
gyroscopes. The embedded microcontroller allows sensor
integration, initialization, calibration, data compensation, and
computation functions to be added to the platform, thereby off-
loading those functions from the host processor. Total system
power consumption is significantly reduced because the
application processor stays powered down for longer periods of
time.
The FXLC95000CL device is programmed and configured with
CodeWarrior Development Studio for Microcontroller (Eclipse
IDE). This standard, integrated development environment (IDE)
enables customers to quickly implement custom embedded
algorithms and features to exactly match their application needs.
Hardware Features
FXLC95000CL
24-LEAD LGA
3 mm by 5 mm by 1 mm
Case 2208-01
Top View
RGPIO8 / PDB_B
RGPIO12 / MISO1
RGPIO11 / MOSI1
RGPIO10 / SCLK1
RGPIO7 / AN1+ / TPMCH1
RGPIO6 / AN0- / TPMCH0
RGPIO5 / PDB_A / INT_O
V
SS
RGPIO4 / INT_I
RGPIO3 / SDA1 / SSB
RGPIO13 / SSB1
RGPIO2 / SCL1 / MISO
RGPIO14 / SCL1
RGPIO15 / SDA1
V
SSIO
V
DDIO
V
DD
BKGD-MS / RGPIO9
RESETB
SCL0 / RGPIO0 / SCLK
Pin Connections
• 3-axis low noise accelerometer
• ±2
g,
±4
g,
±8
g
configurable dynamic ranges available
• Up to 16-bit resolution
• 32-bit MCU
• Coldfire V1 CPU with MAC hardware unit
• 128K Flash, 16K RAM, 16K ROM
• 10-, 12-, 14-, and 16-bit, trimmed analog-to-digital converter (ADC) data formats available
• Master and slave, I
2
C and SPI serial connectivity modules
• Sleep and low power modes to enable local power
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2012–2013 Freescale
Semiconductor, Inc. All rights reserved.
SDA0 / RGPIO1 / MOSI
V
SS
V
DDA
V
SSA

FXLC95000CLR1 Related Products

FXLC95000CLR1 FXLC95000CL
Description SPECIALTY MICROPROCESSOR CIRCUIT, PBGA24 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA24
Number of functions 1 1
Number of terminals 24 24
Maximum operating temperature 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel
Maximum supply/operating voltage 1.89 V 1.89 V
Minimum supply/operating voltage 1.71 V 1.71 V
Rated supply voltage 1.8 V 1.8 V
Processing package description 3 X 5 MM, 1 MM HEIGHT, LGA-24 3 X 5 MM, 1 MM HEIGHT, LGA-24
state ACTIVE ACTIVE
Craftsmanship CMOS CMOS
packaging shape RECTANGULAR RECTANGULAR
Package Size GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
surface mount Yes Yes
Terminal form BUTT BUTT
Terminal spacing 0.5000 mm 0.5000 mm
Terminal location BOTTOM BOTTOM
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level INDUSTRIAL INDUSTRIAL
Microprocessor type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT

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