Universal Sensor Conditioner with Dual Look Up Table Memory and DACs
FEATURES
• Two Programmable Current Generators
—±3.2 mA max.
—8-bit (256 Step) Resolution
—Internally Programmable full scale Current
Outputs
—External Resistor Pin to set full scale Current
Outputs
• Integrated 8-bit A/D Converter
• Internal Voltage Reference with Output/Input
• Temperature Compensation
—Internal or External Sensor
—–40°C to +100°C Range
—2.2°C / step resolution
—EEPROM Look-up Tables
• Hot Pluggable
• 2176-bit EEPROM
—17 Pages
—16 Bytes per Page
• Write Protection Circuitry
—Xicor BlockLock™
—Logic Controlled Protection
—2-wire Bus with 3 Slave Address Bits
• 3 V to 5.5 V, Single Supply Operation
• Package
—14-Lead TSSOP
APPLICATIONS
• PIN Diode Bias Control
• RF PA Bias Control
• Temperature Compensated Process Control
• Laser Diode Bias Control
• Fan Control
•
•
•
•
•
•
•
X96012
Motor Control
Sensor Signal Conditioning
Data Aquisition Applications
Gain vs. Temperature Control
High Power Audio
Open Loop Temperature Compensation
Close Loop Current, Voltage, Pressure, Tempera-
ture, Speed, Position Programmable Voltage
sources, electronic loads, output amplifiers, or
function generator
DESCRIPTION
The X96012 is a highly integrated bias controller
which incorporates two digitally controlled Program-
mable Current Generators, temperature compensa-
tion
with
dedicated
look-up
tables,
and
supplementary EEPROM array. All functions of the
device are controlled via a 2-wire digital serial inter-
face.
Two temperature compensated Programmable Current
Generators, vary the output current with temperature
according to the contents of the associated nonvolatile
look-up table. The look-up table may be programmed
with arbitrary data by the user, via the 2-wire serial
port, and either an internal or external temperature
sensor may be used to control the output current
response.
The integrated General Purpose EEPROM is included
for product data storage.
BLOCK DIAGRAM
Voltage
Reference
VRef
VSense
ADC
Mux
Temperature
Sensor
Look-up
Table 1
Control
& Status
General
Purpose
Memory
Mux
DAC 1
I1
Mux
Look-up
Table 2
Mux
DAC 2
R2
I2
R1
SDA
SCL
WP
A2, A1, A0
REV 1.7 6/23/03
2-Wire
Interface
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X96012
PIN CONFIGURATION
A0
A1
A2
Vcc
WP
SCL
SDA
1
2
3
4
5
6
7
14
13
12
11
10
9
8
I2
VRef
VSense
Vss
R2
R1
I1
TSSOP 14L
ORDERING INFORMATION
Part Number
X96012V14I
Temperature Range
I = -40 to 100°C
Package
14-Lead TSSOP
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X96012
PIN ASSIGNMENTS
TSSOP
Pin
1
2
3
4
5
Pin
Name
A0
A1
A2
Vcc
WP
Pin Description
Device Address Select Pin 0.
This pin determines the LSB of the device address
required to communicate using the 2-wire interface. The A0 pin has an on-chip pull-down resistor.
Device Address Select Pin 1.
This pin determines the intermediate bit of the device address re-
quired to communicate using the 2-wire interface. The A1 pin has an on-chip pull-down resistor.
Device Address Select Pin 2.
This pin determines the MSB of the device address required to
communicate using the 2-wire interface. The A2 pin has an on-chip pull-down resistor.
Supply Voltage.
Write Protect Control Pin.
This pin is a CMOS compatible input. When LOW, Write Protection
is enabled preventing any “Write” operation. When HIGH, various areas of the memory can be
protected using the Block Lock bits BL1 and BL0. The WP pin has an on-chip pull-down resistor,
which enables the Write Protection when this pin is left floating.
Serial Clock.
This is a TTL compatible input pin. This input is the 2-wire interface clock controlling
data input and output at the SDA pin.
Serial Data.
This pin is the 2-wire interface data into or out of the device. It is TTL
compatible when used as an input, and it is Open Drain when used as an output. This pin requires
an external pull up resistor.
Current Generator 1 Output.
This pin sinks or sources current. The magnitude and direction of
the current is fully programmable and adaptive. The resolution is 8 bits.
Current Programming Resistor 1.
A resistor between this pin and Vss can set the maximum
output current available at pin I1. If no resistor is used, the maximum current must be selected
using control register bits.
Current Programming Resistor 2.
A resistor between this pin and Vss can set the maximum
output current available at pin I2. If no resistor is used, the maximum current must be selected
using control register bits.
Ground.
Sensor Voltage Input.
This voltage input may be used to drive the input of the on-chip A/D con-
verter.
Reference Voltage Input or Output.
This pin can be configured as either an Input or an Output.
As an Input, the voltage at this pin is provided by an external source. As an Output, the voltage
at this pin is a buffered output voltage of the on-chip bandgap reference circuit. In both cases, the
voltage at this pin is the reference for the A/D
converter and the two D/A converters.
Current Generator 2 Output.
This pin sinks or sources current. The magnitude and direction of
the current is fully programmable and adaptive. The resolution is 8 bits.
6
7
SCL
SDA
8
9
I1
R1
10
R2
11
12
13
Vss
VSense
VRef
14
I2
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X96012
ABSOLUTE MAXIMUM RATINGS
All voltages are referred to Vss.
Temperature under bias ...................–65°C to +100°C
Storage temperature ........................–65°C to +150°C
Voltage on every pin except Vcc
................ –1.0V to +7V
Voltage on Vcc Pin............................................. 0 to 5.5V
D.C. Output Current at pin SDA
...................... 0 to 5 mA
D.C. Output Current at pins R1, R2,
VRef and VSense ....................................-0.50 to 1 mA
D.C. Output Current at pins I1 and I2 ........-3.5 to +3.5mA
COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.
Lead temperature (soldering, 10 seconds).........300°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Temperature
Temperature while writing to memory
Voltage on Vcc Pin
Voltage on any other Pin
Min.
–40
0
3
-0.3
Max.
+100
+70
5.5
Vcc + 0.3
Units
°C
°C
V
V
ELECTRICAL CHARACTERISTICS
(Conditions are as follows, unless otherwise specified)
All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are
over the recommended operating conditions. All voltages are referred to the voltage at pin Vss. All bits in control
registers are “0”. 255
Ω
, 0.1%, resistor connected between R1 and Vss, and another between R2 and Vss. 400kHz
TTL input at SCL. SDA pulled to Vcc through an external 2K
Ω
resistor. 2-wire interface in “standby” (see notes 1 and
2 on page 5). WP, A0, A1, and A2 floating. VRef pin unloaded.
Symbol
Iccstby
Iccfull
Parameter
Standby current into Vcc
pin
Full operation current into
Vcc pin
Min
Typ
Max
2
15
Unit
mA
mA
Test Conditions / Notes
R1 and R2 floating, VRef unloaded.
2-wire interface reading from
memory, I
1
and I
2
both connected to
Vss, DAC input bytes: FFh, VRef
unloaded.
Average from START condition until
t
WP
after the STOP condition
WP: Vcc, R1 and R2 floating,
VRef unloaded.
V(WP), V(A0), V(A1), and V(A2) from
0V to Vcc
Iccwrite
Nonvolatile Write current
into Vcc pin
4
mA
I
PLDN
On-chip pull down
current at WP, A0, A1,
and A2
SCL and SDA, input Low
voltage
SCL and SDA, input High
voltage
SCL and SDA input
current
SDA output Low voltage
SDA output High current
0
1
20
µ
A
V
ILTTL
V
IHTTL
I
INTTL
V
OLSDA
I
OHSDA
REV 1.7 6/23/03
0.8
2.0
-1
0
0
10
0.4
100
V
V
µ
A
V
µ
A
Pin voltage between 0 and Vcc, and
SDA as an input.
I(SDA) = 2 mA
V(SDA) = Vcc
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X96012
ELECTRICAL CHARACTERISTICS (CONTINUED)
Symbol
V
ILCMOS
V
IHCMOS
VRefout
RVref
TCOref
VRef Range
TSenseRange
I
R
V
POR
VccRamp
V
ADCOK
Parameter
WP, A0, A1, and A2 input
Low voltage
WP, A0, A1, and A2 input
High voltage
Output Voltage at VRef at
25°C
VRef pin input resistance
Temperature coefficient
of VRef output voltage
Voltage range when VRef
is an input
Temperature sensor
range
Current from pin R1 or R2
to Vss
Power on reset threshold
voltage
Vcc Ramp Rate
ADC enable minimum
voltage
Min
0
0.8 x
Vcc
1.205
20
-100
1
-40
0
1.5
0.2
2.6
Typ
Max
0.2 x
Vcc
Vcc
Unit
V
V
V
k
Ω
ppm/
°C
V
°C
µ
A
V
mV /
µ
s
V
Test Conditions / Notes
1.21
1.215
40
+100
1.3
100
3200
2.8
50
2.8
-20
µ
A
≤
I(VRef)
≤
20
µ
A
VRM bit = “1”, 25°C
See note 4 and 5.
See note 3.
See note 4.
See Figure 11.
Notes:
1. The device goes into Standby: 200 ns after any STOP, except those that initiate a nonvolatile write cycle. It goes into Standby t
WC
after a STOP that initiates a nonvolatile write cycle. It also goes into Standby 9 clock cycles after any START that is not followed by
the correct Slave Address Byte.
2. t
WC
is the time from a valid STOP condition at the end of a write sequence to the end of the self-timed internal nonvolatile write
cycle. It is the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
3. For this range of V(VRef) the full scale sink mode current at I1 and I2 follows V(VRef) with a linearity error smaller than 1%.
4. These parameters are periodically sampled and not 100% tested.
5. TCO
ref
= [Max V(V
REF
) – Min V(V
REF
)] x 10
6
/(1.21V x 140°C)
REV 1.7 6/23/03
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