BCM-3601-X02
Sub-1G FSK Transceiver Module
Features
• Operating voltage: 2.0V~3.6V
• Operating current:
♦
0.5μA (Typ.) @3.3V, Deep Sleep Mode
♦
♦
♦
♦
♦
•
Maximum operating input power: 10dBm@RF-in,
BER=0.1%
•
Modulation type: FSK
• Interface: 12-
pin stamp hole
•
Dimensions: 15.0mm(L)×18.5mm(W)×2.5mm(H)
• Operating temperature:
-40°C~85°C
0.7mA(Typ.) @3.3V, Light Sleep Mode
13.0mA(Typ.) @3.3V, 433MHz RX 2Kbps
13.5mA(Typ.) @3.3V, 433MHz RX 250Kbps
31.0mA(Typ.) @3.3V, 433MHz TX 10dBm
54.0mA(Typ.) @3.3V, 433MHz TX 17dBm
General Description
The BCM-3601-X02 is based on the BC3601 device
and which forms a Sub-1GHz FSK transceiver
module. The module can be used for wireless
applications in the 315MHz, 433MHz, 470MHz,
868MHz and 915MHz ISM (Industrial, Scientific and
Medical) bands. The host MCU can communicate
with the device via a 3-wire or 4-wire SPI interface
for wireless data communications.
•
Receiver sensitivity:
♦
-120dBm(Typ.) @315/433/868/915MHz, 2K
Symbol Rate & BER=0.1%
♦
-111dBm(Typ.) @315MHz, 50K Symbol Rate
& BER=0.1%
-111dBm(Typ.) @433MHz, 50K Symbol Rate
& BER=0.1%
-110dBm(Typ.) @868MHz, 50K Symbol Rate
& BER=0.1%
-110dBm(Typ.) @915MHz, 50K Symbol Rate
& BER=0.1%
-104dBm(Typ.) @315/433/868/915MHz, 250K
Symbol Rate & BER=0.1%
♦
♦
Selection Table
Part Number
BCM-3601-X02-U31
BCM-3601-X02-U43
BCM-3601-X02-U86
BCM-3601-X02-U91
Frequency Band
315MHz
433MHz
868MHz
915MHz
♦
♦
Pin Definition
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
Pin Name
AGND
VDD
CSN
GIO1
GIO2
SDIO
SCK
GIO3
GIO4
AGND
ANT
AGND
Type
P
P
I
I/O
I/O
I/O
I
I/O
I/O
P
AI
P
Ground
Power supply
SPI chip select, low active
Multi-function I/O 1
Multi-function I/O 2
SPI data input/output
SPI clock input
Multi-function I/O 3
Multi-function I/O 4
Ground
Antenna input
Ground
Function Description
Legend: AI=Analog input; I=Digital input; I/O=Digital input/output; P=Power.
Rev. 1.00
1
July 24, 2019
BCM-3601-X02
Module Points to Note
1. The recommended module crystal CL setup value is 0x18. The recommended 433MHz band TX Power setup
value is 0x3c(10dBm), 0x49(13dBm) and 0x8A(17dBm).
2. When attaching the module, it is not recommended to have traces underneath the module on the reverse side of
the PCB. The diagram shows a practical application.
Note: It is not recommended to have traces within the green frame area.
3. In practical applications ensure that metallic objects are kept as far away as possible from the antenna.
Rev. 1.00
3
July 24, 2019
BCM-3601-X02
Copyright
©
2019 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time
of publication. However, Holtek assumes no responsibility arising from the use of
the specifications described. The applications mentioned herein are used solely
for the purpose of illustration and Holtek makes no warranty or representation that
such applications will be suitable without further modification, nor recommends
the use of its products for application that may present a risk to human life due to
malfunction or otherwise. Holtek's products are not authorized for use as critical
components in life support devices or systems. Holtek reserves the right to alter
its products without prior notification. For the most up-to-date information, please
visit our web site at http://www.holtek.com.
Rev. 1.00
5
July 24, 2019
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