IS25LP128-JKLA2 datasheet, PDF

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IS25LP128-JKLA2: DescriptionFlash, 128MX1, PDSO8, WSON-8; Categorystorage storage; File Size2MB，83 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS25LP128-JKLA2 Overview

Flash, 128MX1, PDSO8, WSON-8

IS25LP128-JKLA2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	HVSON, SOLCC8,.2
Reach Compliance Code	compli
ECCN code	EAR99
Spare memory width	1
Maximum clock frequency (fCLK)	133 MHz
command user interface	NO
Data polling	NO
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8
JESD-609 code	e3
length	6 mm
memory density	134217728 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	8
word count	16384 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	16MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Filter level	AEC-Q100
Maximum seat height	0.8 mm
Serial bus type	4-WIRE
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
width	5 mm
write protect	HARDWARE/SOFTWARE

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IS25LP128

128M-BIT

3V- MULTI I/O SERIAL FLASH MEMORY WITH 133MHZ SPI

BUS & QUAD I/O (QPI) DTR INTERFACE

DATA SHEET

IS25LP128

GENERAL DESCRIPTION

The IS25LP128 Serial Flash memory offers a storage solution with the flexibility and performance in a simplified

pin count package. ISSI’s “Industry Standard Serial Interface” flash are for systems that have limited space,

pins, and power. The IS25LP128 are accessed through a 4-wire SPI Interface consisting of a Serial Data Input

(Sl), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins, which also serve as multi-

function I/O (see pin descriptions).

The device supports the standard Serial Peripheral Interface (SPI), Dual/Quad output (SPI), and Dual/Quad I/O

(SPI). Clock frequencies of up to 133MHz allow for equivalent clock rates of up to 532MHz (133MHz x 4)

allowing more than 66MBytes/S of throughput. The IS25xP series of flash adds support for DTR (Double

Transfer Rate) commands that transfer address and read data on both edges of the clock. These transfer rates

can outperform 16-bit Parallel Flash memories allowing for efficient memory access for a XIP (execute in place)

operation.

The memory array is organized into programmable pages of 256-bytes each. The IS25LP128 supports page

program mode where 1 to 256 bytes of data can be programmed into the memory with one command. QPI

(Quad Peripheral Interface) supports 2-cycles instruction cycles further reducing instruction times. Pages can

be erased in groups of 4K-byte sectors, 32K-byte blocks, 64K-byte blocks, and/or the entire chip. The uniform

sectors and blocks allow greater flexibility for a variety of applications requiring solid data retention.

GLOSSARY

Standard SPI

The IS25LP032/064 is accessed through a 4-wire SPI Interface consisting of Serial Data Input (Sl), Serial Data

Output (SO), Serial Clock (SCK), and Chip Enable (CE#) pins. Instructions are inputted through the SI pin to

encode instructions, addresses, or input data to the device on the rising edge of SCK. The DO pin is used to

read data or check the status of the device on the falling edge of SCK. This device supports SPI bus operation

mode (0,0) and (1,1).

Mutil I/O SPI

The IS25LP032/064 allows accessing enhanced SPI protocol to use Dual output, Dual input and output, and

Quad input and output operation. Executing these instructions through SPI mode will achieve double or

quadruple the transfer bandwidth for READ and PROGRAM.

Quad I/O (QPI)

The IS25LP032/064 can enable QPI protocol by issuing an “Enter QPI mode (35h)” command. The QPI mode

uses four IO pins for input and output to reduce SPI instruction overhead and increase output bandwidth. QPI

mode can exit by issuing an “Exit QPI (F5h) command. A power reset or software reset can also return the

device into the standard SPI mode. SI and SO pins become bidirectional IO0 and IO1, and WP# and HOLD#

pins become IO2 and IO3 respectively during QPI mode.

DTR

In addition to SPI and QPI features, IS25LP032/064 also supports DTR READ. DTR allows high data throughput

while running at lower clock frequencies. As DTR READ option uses both rising and falling clock to drive output,

the dummy cycles are reduced by half as well.

Programmable drive strength and Selectable burst setting.

The IS25LP032/064 offers programmable output drive strength and selectable burst (wrap) length features to

increase the efficiency and performance of READ operations. The driver strength and burst setting features are

controlled by setting READ registers. A total of six different drive strengths and four different burst sizes

(8/16/32/64Bytes) are selectable.

Integrated Silicon Solution, Inc.- www.issi.com

Rev. 0A

4/03/2014

IS25LP128

TABLE OF CONTENTS

PIN CONFIGURATION ................................................................................................................................................. 6

PIN DESCRIPTIONS .................................................................................................................................................... 7

BLOCK DIAGRAM ........................................................................................................................................................ 8

SPI MODES DESCRIPTION ......................................................................................................................................... 9

SYSTEM CONFIGURATION ...................................................................................................................................... 11

5.1 BLOCK/SECTOR ADDRESSES ........................................................................................................................... 11

REGISTERS ............................................................................................................................................................... 12

6.1. STATUS REGISTER ............................................................................................................................................ 12

6.2. FUNCTION REGISTER ....................................................................................................................................... 14

6.3 READ REGISTERS .............................................................................................................................................. 15

PROTECTION MODE ................................................................................................................................................. 17

7.1 HARDWARE WRITE PROTECTION .................................................................................................................... 17

7.2 SOFTWARE WRITE PROTECTION ..................................................................................................................... 17

DEVICE OPERATION................................................................................................................................................. 18

8.1 NORMAL READ OPERATION (NORD, 03h) ........................................................................................................ 20

8.2 FAST READ DATA OPERATION (FRD, 0Bh) ...................................................................................................... 21

8.3 HOLD OPERATION .............................................................................................................................................. 23

8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ............................................................................................ 23

8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) .................................................................................... 25

8.6 FAST READ QUAD I/O OPERATION (FRQIO, EBh) ........................................................................................... 26

8.7 PAGE PROGRAM OPERATION (PP, 02h) .......................................................................................................... 29

8.8 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 32h/38h) .......................................................................... 31

8.9 ERASE OPERATION ............................................................................................................................................ 32

8.10 SECTOR ERASE OPERATION (SER, D7h/20h) ................................................................................................ 33

8.11 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h) ............................................................................. 34

8.12 CHIP ERASE OPERATION (CER, C7h/60h) ...................................................................................................... 36

8.13 WRITE ENABLE OPERATION (WREN, 06h) ..................................................................................................... 37

8.14 WRITE DISABLE OPERATION (WRDI, 04h) ..................................................................................................... 38

8.15 READ STATUS REGISTER OPERATION (RDSR, 05h) .................................................................................... 39

8.16 WRITE STATUS REGISTER OPERATION (WRSR, 01h) .................................................................................. 40

8.17 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ................................................................................ 41

8.18 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h) .............................................................................. 42

8.19 ENTER QUAD PERIPHERAL INTERFACE (QPI) MODE OPERATION (QIOEN,35h; QIODI,F5h) ................... 43

8.20 PROGRAM/ERASE SUSPEND & RESUME ...................................................................................................... 44

8.21 DEEP POWER DOWN (DP, B9h) ....................................................................................................................... 45

8.22 RELEASE DEEP POWER DOWN (RDPD, ABh) ................................................................................................ 46

8.23 SET READ PARAMETERS OPERATION (SRP, C0h) ....................................................................................... 46

8.24 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................................. 49

8.25 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ............................................ 51

Integrated Silicon Solution, Inc.- www.issi.com

Rev. 0A

4/03/2014

IS25LP128

8.26 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) .......................................... 52

8.27 READ UNIQUE ID NUMBER (RDUID, 4Bh) ....................................................................................................... 54

8.28 READ SFDP OPERATION (RDSFDP, 5Ah) ....................................................................................................... 55

8.29 NO OPERATION (NOP, 00h).............................................................................................................................. 62

8.30 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h) .............................................. 62

8.31 MODE RESET OPERATION (RSTM, FFh) ........................................................................................................ 63

8.32 SECURITY INFORMATION ROW ...................................................................................................................... 64

8.33 INFORMATION ROW ERASE OPERATION (IRER, 64h) .................................................................................. 64

8.34 INFORMATION ROW PROGRAM OPERATION (IRP, 62h)............................................................................... 65

8.35 INFORMATION ROW READ OPERATION (IRRD, 68h) .................................................................................... 66

8.36 FAST READ DTR MODE OPERATION (FRDTR, 0Dh) ...................................................................................... 67

8.37 FAST READ DUAL IO DTR MODE OPERATION (FRDDTR, BDh).................................................................... 68

8.38 FAST READ QUAD IO DTR MODE OPERATION (FRQDTR, EDh) ................................................................... 69

8.39 SECTOR LOCK/UNLOCK FUNCTIONS ............................................................................................................. 70

ELECTRICAL CHARACTERISTICS ........................................................................................................................... 72

9.1 ABSOLUTE MAXIMUM RATINGS

(1)

.................................................................................................................... 72

9.2 OPERATING RANGE ........................................................................................................................................... 72

9.3 DC CHARACTERISTICS ...................................................................................................................................... 72

9.4 AC MEASUREMENT CONDITIONS ..................................................................................................................... 73

9.5 AC CHARACTERISTICS ...................................................................................................................................... 74

9.6 SERIAL INPUT/OUTPUT TIMING

(1)

.................................................................................................................... 75

9.7 POWER-UP AND POWER-DOWN ....................................................................................................................... 75

9.8 PROGRAM/ERASE PERFORMANCE .................................................................................................................. 76

10.

PACKAGE TYPE INFORMATION ......................................................................................................................... 78

10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB)

10.2 8-Contact Ultra-Thin Small Outline No-Lead WSON (6x5mm) (JK)

10.3 8-Contact Ultra-Thin Small Outline No-Lead WSON (8x6mm) (JL)

10.4 8-Pin 208mil VSOP Package (JF)

(1)

........................................ 77

................................................................. 78

................................................................. 79

................................................................................................................... 80

(1)

10.4 16-lead Plastic Small Outline package (300 mils body width) (JM)

................................................................. 8

Integrated Silicon Solution, Inc.- www.issi.com

Rev. 0A

4/03/2014

IS25LP128-JKLA2 Related Products

	IS25LP128-JKLA2	IS25LP128-JLLA1	IS25LP128-JLLA2	IS25LP128-JLLA3	IS25LP128-JMLA1	IS25LP128-JMLA2	IS25LP128-JMLA3	IS25LP128-JKLA1	IS25LP128-JKLA3
Description	Flash, 128MX1, PDSO8, WSON-8	Flash, 128MX1, PDSO8, WSON-8	Flash, 128MX1, PDSO8, WSON-8	Flash, 128MX1, PDSO8, WSON-8	Flash, 128MX1, PDSO16, SOIC-16	Flash, 128MX1, PDSO16, SOIC-16	Flash, 128MX1, PDSO16, SOIC-16	Flash, 128MX1, PDSO8, WSON-8	Flash, 128MX1, PDSO8, WSON-8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	HVSON, SOLCC8,.2	WSON-8	WSON-8	WSON-8	SOP, SOP16,.4	SOP, SOP16,.4	SOP, SOP16,.4	HVSON, SOLCC8,.2	HVSON, SOLCC8,.2
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Spare memory width	1	1	1	1	1	1	1	1	1
Maximum clock frequency (fCLK)	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz	133 MHz
Data retention time - minimum	20	20	20	20	20	20	20	20	20
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-N8	R-PDSO-N8
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3	e3
length	6 mm	8 mm	8 mm	8 mm	10.31 mm	10.31 mm	10.3 mm	6 mm	6 mm
memory density	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	1	8	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	16	16	16	8	8
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	134217728 words	16384 words	134217728 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	128000000	16000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	105 °C	85 °C	105 °C	125 °C	85 °C	105 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8	128MX1	16MX8	128MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	HVSON	HVSON	HVSON	SOP	SOP	SOP	HVSON	HVSON
Encapsulate equivalent code	SOLCC8,.2	SOLCC8,.2	SOLCC8,.2	SOLCC8,.2	SOP16,.4	SOP16,.4	SOP16,.4	SOLCC8,.2	SOLCC8,.2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Filter level	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100
Maximum seat height	0.8 mm	0.85 mm	0.85 mm	0.85 mm	2.65 mm	2.65 mm	2.65 mm	0.8 mm	0.8 mm
Serial bus type	4-WIRE	4-WIRE	4-WIRE	4-WIRE	4-WIRE	4-WIRE	4-WIRE	4-WIRE	4-WIRE
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.3 V	2.7 V	2.3 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE
Terminal surface	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	5 mm	6 mm	6 mm	6 mm	7.49 mm	7.49 mm	7.5 mm	5 mm	5 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
command user interface	NO	NO	NO	NO	NO	NO	-	NO	-
Data polling	NO	NO	NO	NO	NO	NO	-	NO	-

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