EEWORLDEEWORLDEEWORLD

Part Number

Search

C0603C201M4GACTM

Description
CAPACITOR, CERAMIC, MULTILAYER, 16V, C0G, 0.0002uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size1MB,9 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance  
Download Datasheet Parametric View All

C0603C201M4GACTM Overview

CAPACITOR, CERAMIC, MULTILAYER, 16V, C0G, 0.0002uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

C0603C201M4GACTM Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerKEMET
package instruction, 0603
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.0002 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.8 mm
JESD-609 codee3
length1.6 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH
positive tolerance20%
Rated (DC) voltage (URdc)16 V
size code0603
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width0.8 mm
CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
SIZE CODE
EIA
SIZE
SIZE
CODE
METRIC
(Ref only)
CODE
SIZE CODE
0402*
1005
EIA
METRIC
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
T
THICKNESS
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
0201*
0603*
0402*
0805*
0603
1206*
0805*
1210*
1206*
1812
2220
2225
1812
0603
1608
1005
2012
1608
3216
2012
3225
3216
4532
4564
5650
5664
4532
4564
5650
5664
1210*
1825*
1825*
2220
2225
3225
See page 78
for thickness
dimensions.
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV) – special order only
G – ±2%
Z – +80%, -20%
72
Military see page
87)
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1
- 100V
1
- 100V 3 - 25V
25V
3-
2 - 200V 4 - 16V
2
- 50V 8 - 10V
16V
- 200V
4-
5
5
- 35V 9 - 6.3V
10V
8-
6
- 50V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
7 - 4V
- 6.3V
7 - 4V
9
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
ISO 26262 Fault Tolerance Time Interval
I would like to share with you another important concept in functional safety - Fault Tolerant Time Interval (FTTI).Fault Tolerant Time Interval is a core concept in ISO 26262, and can also be called ...
Aguilera Microcontroller MCU
Regarding the calculation of filter capacitor, I urgently need an explanation~~~
I have posted a picture below. I don’t understand the formula (2.12) in the picture. I can’t find any relevant explanation. Can any expert explain it to me?...
xcyseh Power technology
How to use ROMS instructions in CCS
I was reading the documentation of VC5509A recently. I can run programs with an emulator, but I can't write programs into it, so I was reading the content of Hex Conversion Utility. I can call Hex Con...
dontium DSP and ARM Processors
W806 Lianshengde 9.9 yuan development board experience 5 --- demo completed experience end
SPI-DMA has been added, and the speed is faster than before. The playability is still quite high even with a lower resolution. There is enough ROM and RAM space. However, the SDK peripheral drivers ne...
RCSN Domestic Chip Exchange
File filter driver binding problem.
To bind a file, you must first bind the device object and then bind the volume to read and write. However, in the sfilter that comes with DDK, after binding the device, it will determine whether WINVE...
weisheihuozhe Embedded System
I have a question about the RJ11 interface
How do you represent RJ11 in PROTEL's sch? There are 11 pins in a circuit diagram, but there are only 6 pins in the PCB package....
天天雨 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1473  1755  327  758  208  30  36  7  16  5 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号