®
HM-65642/883
8K x 8 Asynchronous
CMOS Static RAM
Description
The HM-65642/883 is a CMOS 8192 x 8-bit Static Random
Access Memory. The pinout is the JEDEC 28 pin, 8-bit wide
standard, which allows easy memory board layouts which
accommodate a variety of industry standard ROM, PROM,
EPROM, EEPROM and RAMs. The HM-65642/883 is ideally
suited for use in microprocessor based systems. In particu-
lar, interfacing with the Intersil 80C86 and 80C88 micropro-
cessors is simplified by the convenient output enable (G)
input.
The HM-65642/883 is a full CMOS RAM which utilizes an
array of six transistor (6T) memory cells for the most stable
and lowest possible standby supply current over the full mili-
tary temperature range.
May 2002
Features
• This Circuit is Processed in Accordance to MIL-STD-
883 and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
• Full CMOS Design
• Six Transistor Memory Cell
• Low Standby Supply Current . . . . . . . . . . . . . . . . 100µA
• Low Operating Supply Current. . . . . . . . . . . . . . . 20mA
• Fast Address Access Time . . . . . . . . . . . . . . . . . . 150ns
• Low Data Retention Supply Voltage . . . . . . . . . . . 2.0V
• CMOS/TTL Compatible Inputs/Outputs
• JEDEC Approved Pinout
• Equal Cycle and Access Times
• No Clocks or Strobes Required
• Gated Inputs
- No Pull-Up or Pull-Down Resistors Required
• Temperature Range -55
o
C to +125
o
C
• Easy Microprocessor Interfacing
• Dual Chip Enable Control
Ordering Information
PACKAGE
CERDIP
CLCC
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
150ns/75µA
HM1-65642B/883
HM4-65642B/883
150ns/150µA
HM1-65642/883
HM4-65642/883
200ns/250µA
HM1-65642C/883
-
PKG. NO.
F28.6
J32.A
Pinouts
HM-65642/883 (CERDIP)
TOP VIEW
NC 1
A12 2
A7 3
A6 4
A5 5
A4 6
A3 7
A2 8
A1 9
A0 10
DQ0 11
DQ1 12
DQ2 13
GND 14
28 VCC
27 W
26 E2
25 A8
24 A9
23 A11
22 G
21 A10
20 E1
19 DQ7
18 DQ6
17 DQ5
16 DQ4
15 DQ3
A6
A5
A4
A3
A2
5
6
7
8
9
HM4-65642/883 (CLCC)
TOP VIEW
VCC
A12
NC
NC
A7
E2
W
4
3
2
1
32
31
30
29 A8
28 A9
27 A11
26 NC
25 G
24 A10
23 E1
22 DQ7
21 DQ6
PIN
A
DQ
E1
E2
W
G
NC
GND
VCC
DESCRIPTION
Address Input
Data Input/Output
Chip Enable
Chip Enable
Write Enable
Output Enable
No Connections
Ground
Power
A1 10
A0
NC
DQ0
11
12
13
14
DQ1
15 16
DQ2
GND
17
NC
18
DQ3
19
DQ4
20
DQ5
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
FN3004.2
220
HM-65642/883
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input or Output Voltage Applied for all Grades. . . . . . . GND -0.3V to
VCC +0.3V
Typical Derating Factor . . . . . . . . . . . 5mA/MHz Increase in ICCOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Information
Thermal Resistance (Typical)
θ
JA
θ
JC
o
C/W
o
C/W
CERDIP Package . . . . . . . . . . . . . . . . 45
8
10
o
C/W
CLCC Package . . . . . . . . . . . . . . . . . . 55
o
C/W
Maximum Storage Temperature Range . . . . . . . . .-65
o
C to +150
o
C
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . +175
o
C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . +300
o
C
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101,000 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range. . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Input Low Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.8V
Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . +2.2V to VCC +0.3V
Data Retention Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 2.0V
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . 40ns Max.
TABLE 1. HM-65642/883 DC ELECTRICAL PERFORMANCE SPECIFICATIONS
Device Guaranteed and 100% Tested
(NOTE 1)
CONDITIONS
VCC = 4.5V, IO = -1.0mA
VCC = 4.5V, IO = 4.0mA
HM-65642B/883, HM-65642/883
VCC = 5.5V, G = 2.2V,
VI/O = GND or VCC
HM-65642C/883
VCC = 5.5V, G = 2.2V,
VI/O = GND or VCC
Input Leakage
Current
II
HM-65642B/883, HM-65642/883
VCC = 5.5V, VI = GND or VCC
HM-65642C/883
VCC = 5.5V, VI = GND or VCC
Standby Supply
Current
ICCSB1
HM-65642B/883
VCC = 5.5V, E1 = VCC -0.3V or
E2 = GND +0.3V
HM-65642/883
VCC = 5.5V, E1 = VCC -0.3V or
E2 = GND +0.3V
HM-65642C/883
VCC = 5.5V, E1 = VCC -0.3V or
E2 = GND +0.3V
Standby Supply
Current
Enable Supply
Current
Operating Supply
Current
ICCSB
ICCEN
ICCOP
VCC = 5.5V, IO = 0mA, E1 = 2.2V or
E2 = 0.8V
VCC = 5.5V, IO = 0mA, E1 =0.8V,
E2 = 2.2V
VCC = 5.5V, G = 5.5V, (Note 2),
f = 1MHz, E1 = 0.8V, E2 = 2.2V
GROUP A
SUBGROUPS
1, 2, 3
1, 2, 3
1, 2, 3
LIMITS
TEMPERATURE
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
MIN
2.4
-
-1.0
MAX
-
0.4
+1.0
UNITS
V
V
µA
PARAMETER
High Level Output
Voltage
Low Level Output
Voltage
High Impedance
Output Leakage
Current
SYMBOL
VOH 1
VOL
IIOZ
1, 2, 3
-2.0
+2.0
µA
1, 2, 3
1, 2, 3
1, 2, 3
-1.0
-2.0
-
+1.0
+2.0
100
µA
µA
µA
1, 2, 3
-
250
µA
1, 2, 3
-
400
µA
1, 2, 3
1, 2, 3
1, 2, 3
-
-
-
5
5
20
mA
mA
mA
221
HM-65642/883
TABLE 1. HM-65642/883 DC ELECTRICAL PERFORMANCE SPECIFICATIONS (Continued)
Device Guaranteed and 100% Tested
(NOTE 1)
CONDITIONS
HM-65642B/883
VCC = 2.0V, E1 = VCC -0.3V or
E2 = GND +0.3V
HM-65642/883
VCC = 2.0V, E1 = VCC -0.3V or
E2 = GND +0.3V
HM-65642C/883
VCC = 2.0V, E1 = VCC -0.3V or
E2 = GND +0.3V
Functional Test
NOTES:
1. All voltages referenced to device GND.
2. Typical derating 5mA/MHz increase in ICCOP.
3. Tested as follows: f = 2MHz, VIH = 2.4V, VIL = 0.4V, IOH = -4.0mA, IOL = 4.0mA, VOH
≥
1.5V, and VOL
≤
1.5V.
TABLE 2. HM-65642/883 AC ELECTRICAL PERFORMANCE SPECIFICATIONS
LIMITS
GROUP A
SUB-
GROUPS
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
HM-
65642B/883
TEMPERATURE
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
MIN
150
-
-
-
10
MAX
-
150
70
150
-
HM-
65642/883
MIN
150
-
-
-
10
MAX
-
150
70
150
-
HM-
65642C/883
MIN
200
-
-
-
10
MAX
-
200
70
200
-
UNITS
ns
-
ns
ns
ns
PARAMETER
Data Retention
Supply Current
SYMBOL
ICCDR
GROUP A
SUBGROUPS
1, 2, 3
LIMITS
TEMPERATURE
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
MIN
-
MAX
75
UNITS
µA
1, 2, 3
-
150
µA
1, 2, 3
-
250
µA
FT
VCC = 4.5V (Note 3)
7, 8A, 8B
-
-
-
PARAMETERS
Read/Write/
Cycle Time
Address Access
Time
Output Enable
Access Time
Chip Enable
Access Time
Write Recovery
Time
Chip Enable to
End-of-Write
Address Setup
Time
Write Enable
Pulse Width
Data Setup Time
SYMBOL
TAVAX
TAVQV
TGLQV
TE1LQV
TE2HQV
TWHAX
TE1HAX
TE2LAX
TE1LE1H
TE2HE2L
TAVWL
TAVE1L
TAVE2H
TWLWH
TDVWH
TDVE1H
TDVE2L
(NOTES 1, 2)
CONDITIONS
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
9, 10, 11
9, 10, 11
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
90
0
-
-
90
0
-
-
120
0
-
-
ns
ns
9, 10, 11
9, 10, 11
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
90
60
-
-
90
60
-
-
120
80
-
-
ns
ns
222
HM-65642/883
TABLE 2. HM-65642/883 AC ELECTRICAL PERFORMANCE SPECIFICATIONS (Continued)
LIMITS
GROUP A
SUB-
GROUPS
9, 10, 11
9, 10, 11
9, 10, 11
HM-
65642B/883
TEMPERATURE
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
MIN
5
10
10
MAX
-
-
-
HM-
65642/883
MIN
5
10
10
MAX
-
-
-
HM-
65642C/883
MIN
5
10
10
MAX
-
-
-
UNITS
ns
ns
ns
PARAMETERS
Data Hold Time
SYMBOL
TWHDX
TE1HDX
TE2LDX
(NOTES 1, 2)
CONDITIONS
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
VCC = 4.5V and
5.5V
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume transition time
≤
5ns; input levels = 0.0V to 3.0V; timing reference levels = 1.5V; output load = 1TTL equivalent
load and CL
≥
50pF, for CL > 50pF, access times are derated 0.15ns/pF.
TABLE 3. HM-65642/883 ELECTRICAL PERFORMANCE SPECIFICATIONS
LIMITS
PARAMETER
Output High Voltage
Input Capacitance
SYMBOL
VOH2
CIN
CONDITIONS
VCC = 4.5V, IO = -100µA
VCC = Open, f = 1MHz, All
Measurements Refer-
enced to Device Ground
VCC = Open, f = 1MHz, All
Measurements Refer-
enced to Device Ground
I/O Capacitance
CI/O
VCC = Open, f = 1MHz, All
Measurements Refer-
enced to Device Ground
VCC = 4.5V, VI/O = GND
or VCC, All Measurements
Referenced to Device
Ground
Write Enable to Output in High Z
Write Enable High to Output ON
Chip Enable to Output ON
Output Enable to Output ON
Chip Enable to Output in High Z
TWLQZ
TWHQX
TE1LQX
TE2HQX
TGLQX
TE1HQZ
TE2LQZ
Output Disable to Output in High Z
TGHQZ
TAXQX
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
NOTES
1
1, 2
TEMPERATURE
-55
o
C
≤
T
A
≤
+125
o
C
T
A
= +25
o
C
MIN
VCC -0.4
-
MAX
-
12
UNITS
V
pF
1, 3
T
A
= +25
o
C
-
10
pF
1, 2
T
A
= +25
o
C
-
14
pF
1, 3
T
A
= +25
o
C
-
12
pF
1
1
1
1
1
1
1
1
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-55
o
C
≤
T
A
≤
+125
o
C
-
5
10
5
-
-
-
10
50
-
-
-
50
60
50
-
ns
ns
ns
ns
ns
ns
ns
ns
Output Hold from Address
Change
NOTES:
1. The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are char-
acterized upon initial design release and upon design changes which would affect these characteristics.
2. Applies to DIP device types only. For design purposes CIN = 6pF typical and CI/O = 7pF typical.
3. Applies to LCC device types only. For design purposes CIN = 4pF typical and CI/O = 5pF typical.
223
HM-65642/883
TABLE 4. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
Interim Test 1
Interim Test
PDA
Final Test 1
Group A
Groups C and D
GROUPS METHOD
100%/5004
100%/5004
100%/5004
100%/5004
Samples/5005
Samples/5005
SUBGROUPS
-
1, 7, 9
1
2, 3, 8A, 8B, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1, 7, 9
224
MCU
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