MMSZ5228CS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> MMSZ5228CS

Preview

MMSZ5228CS: DescriptionZener diode; CategoryDiscrete semiconductor; File Size5MB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

MMSZ5228CS Overview

Zener diode

Features

Product Name: Zener Diode

Product model: MMSZ5228CS

product features:

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Product parameters:

Pd power dissipation: 200mW

Vz stable voltage: Nom=3.9V Min=3.82V Max=3.98V

Zzt breakdown impedance: 23Ω

Zzk breakdown impedance: 1900Ω

IR reverse current: 10uA

Vf forward voltage drop: 0.9V

Package: SOD-323

MMSZ5228CS Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-323 Plastic-Encapsulate Diodes

SOD-323

MMSZ5221CS-MMSZ5259CS

ZENER DIODE

FEATURES

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Maximum Ratings

(Ta=25℃

unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

200

625

-65

+150

Unit

℃/W

℃

Notes: 1. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .

2. Tested with pulses, Tp≤1.0ms.

A,Dec,2011

Recommended Resources

Recorder graphic equalizer drive circuit

Cable breakage measuring instrument circuit

A new type of dimming SM9043 integrated circuit

6-digit cathode fluorescent triode display circuit

DN35 typical application circuit diagram a

Low Ripple Power supply circuit

[Classic Show] Universal mobile phone charger circuit is simple and practical: [i=s]This post was last edited by dontium on 2015-1-23 13:26[/i]:) The chip I want to talk about is APB708N, this one is good!The good thing is that it is simple but not simplistic.Most of the charger...; ddllxxrr Analogue and Mixed Signal

How to access SR in C430: How to access SR in C430?I directly access:SR|=BIT5;the result of compilation is that SR is not defined.Please tell me how to access SR...; yuanqian Microcontroller MCU

Has anyone done a Kalman filter FPGA implementation?: [size=14px]I have read some papers, most of which are just a bunch of formulas and then use DSP Builder[/size] [size=14px]Has anyone used Verilog to implement a Kalman filter? I would like to discuss ...; zpccx FPGA/CPLD

About KernelIoControl: May I ask the experts what is the function of KernelIoControl(IOCTL_HAL_REQUEST_SYSINTR, &g_I2CIrq, sizeof(UINT32), &g_I2CSysIntr, sizeof(UINT32), NULL))? ?...; 1742 Embedded System

How do I determine whether the serial port is sending data?: How can I tell if the serial port is sending data? Is there any other way to measure it using other tools? There is no error in the program I wrote. But I don't know why it doesn't work....; jack2 MCU

Absolutely exquisite hardware design information!!!: If you feel good, give me a thumbs up...HE HE......; clj2004000 DSP and ARM Processors

Popular Components