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ZL50417GKG

Description
LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
CategoryWireless rf/communication    Telecom circuit   
File Size723KB,112 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
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ZL50417GKG Overview

LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553

ZL50417GKG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionHBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B553
JESD-609 codee0
length37.5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals553
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height2.46 mm
Nominal supply voltage2.5 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width37.5 mm
ZL50417
Unmanaged 16-Port 10/100 M + 2-Port
10/100/1000 M Layer-2 Ethernet Switch
Data Sheet
Features
Integrated Single-Chip 10/100/1000 M Ethernet
Switch
• Sixteen 10/100 Mbps auto-negotiating Fast Ethernet
(FE) ports with RMII or GPSI (7WS) interface
options per port
• Two 10/100/1000M auto-negotiating Gigabit
Ethernet (GE) ports with GMII, TBI, and MII
interface options per port
March 2005
Ordering Information
ZL50417GKG
553 Pin HSBGA
-40°C to 85°C
and flooding control
Supports per-system option to enable flow
control for best effort frames even on QoS-
enabled ports
QoS Support
• 4 transmission priorities for Fast Ethernet ports and
8 transmission classes for Gigabit ports
• Per-queue weighted random early discard (WRED)
with 2 drop precedence levels
• Scheduling using delay bounded (DB), strict priority
(SP), and Weighted Fair Queuing (WFQ) disciplines
• User controlled WRED thresholds
• Buffer management: per-class, shared, and per-port
buffer reservations
Operates stand-alone or can be cascaded
• Stacking port supports hot swap in managed
configuration
Supports two Frame Data Buffer (FDB) memory
domains
(2 MB or 4 MB)
with pipelined, sync-burst
SRAM at 100 MHz
• Applies centralized shared memory architecture
L2 Switching
• MAC address self learning, up to 64K MAC
addresses
• Supports port-based VLAN
High performance packet classification and
switching at full-wire speed
CPU access supports the following interface
options:
• Serial interface in unmanaged mode, with optional
I
2
C EEPROM support
Classification based on:
• Port-based priority: priority in a frame can be
overwritten by the priority of port
• VLAN Priority field in VLAN tagged frame (IEEE
802.1p)
Supports Ethernet multicasting and broadcasting
VLAN 1 MCT
Frame Data Buffer A
SRAM (1 M / 2 M)
VLAN 1 MCT
Frame Data Buffer B
SRAM (1 M / 2 M)
FDB Interface
LED
FCB
Frame Engine
Search
Engine
MCT
Link
16 x 10/100M
RMII
Ports 0 - 15
GMII/
PCS
Port
24
GMII/
PCS
Port
25
Management
Module
Serial
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2005, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50417GKG Related Products

ZL50417GKG
Description LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
Is it Rohs certified? incompatible
Maker Zarlink Semiconductor (Microsemi)
package instruction HBGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B553
JESD-609 code e0
length 37.5 mm
Humidity sensitivity level 1
Number of functions 1
Number of terminals 553
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code HBGA
Package shape SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 225
Certification status Not Qualified
Maximum seat height 2.46 mm
Nominal supply voltage 2.5 V
surface mount YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL
Terminal surface TIN LEAD
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature 30
width 37.5 mm

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