Surface Mount PIN Diode Limiter
LM202802-M-C-300 Data Sheet
Features
•
Surface Mount Limiter in Compact Package:
•
•
•
•
•
•
•
8 mm L x 5 mm W x 2.5 mm H
Incorporates NIP and PIN Limiter Diodes
Broadband Performance (2 to 8 GHz)
Higher Average Power Handling than Plastic-Packaged Limiter: 45 dBm Average Power
Low Insertion Loss (1.4 dB)
Low Flat Leakage Power (20 dBm)
RoHS Compliant
Applications
•
Receiver protection
Description
The LM202802-M-C-300 Surface Mount PIN Diode Limiter Module is a surface mount, passive two-stage
power limiter which operates from 2 GHz to 8 GHz. It is manufactured using Aeroflex Metelics proven hybrid
manufacturing process incorporating silicon NIP and PIN diodes integrated onto a ceramic substrate. This
low profile, compact (8 mm L x 5 mm W x 2.5 mm H), surface mount component offers superior small and
large signal performance. This product is designed to minimize small signal insertion loss for very low
receiver noise figure and high isolation for low flat leakage power for effective receiver protection from
20 MHz to 8 GHz.
The design incorporates a silicon NIP coarse limiter diode and a silicon PIN clean-up stage diode to provide
broad band microwave performance from 2 GHz – 8 GHz. The NIP and PIN diode configuration eliminates
the need to include an RF choke to complete the DC bias return path. The very low thermal resistance
(NIP diode: < 20ºC/W, PIN diode: < 90 ºC/W, junction to the bottom surface of the package) enables the
limiter to safely and reliably handle RF CW incident power levels of 45 dBm and RF peak incident power levels
of 53 dBm (1 µs RF pulse width, 0.1% duty cycle). The low PIN and NIP diodes’ series resistances (< 1.5
Ω
)
provide low flat leakage power (< 22 dBm) and the thin I layer of the output stage provides low spike leakage
energy (< 0.5 Ergs) for superior LNA protection. No external control signals are required. This product is
RoHS compliant.
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Document No. DS 13801 Rev.C, ECN 12906
Revision Date: 5/29/2013
PIN Diode Limiter
Environmental Capabilities
The LM202802-M-C-300 Limiter Module is compatible with high volume, surface mount, solder re-flow
manufacturing methods. This product is durable and capable of reliably operating in military, commercial,
and industrial environments. The device is RoHS compliant and is available in tube or tape-reel. The
LM202802-M-C-300 Limiter is capable of meeting the environmental requirements of MIL-STD-750 and MIL-
STD-202
ESD and Moisture Sensitivity Level Rating
As are all semiconductor devices, PIN diode limiters are susceptible to damage from ESD events. The ESD
rating for this device is Class 0 (HBM). The moisture sensitivity level rating for this device is MSL 1.
Limiter Schematic
Pinout
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603-641-3800 • 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13801 Rev.C, ECN 12906
Revision Date: 5/29/2013
PIN Diode Limiter
Absolute Maximum Ratings
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Assembly Temperature
RF Peak Incident Power Handling
@ Z
0
= 50
Ω
, T
A
= +25ºC as measured in Aeroflex evaluation board (Unless Otherwise Defined)
Conditions
Absolute Maximum Value
-65ºC to 150ºC
-65ºC to 150ºC
175ºC
260ºC
53 dBm
t = 30 s
T
CASE
= 85 ºC, source and load VSWR < 1.2:1,
RF pulse width = 1 µs, duty cycle = 0.1%,
derate linearly to 0 W at T
CASE
= 150ºC (note 1)
T
CASE
= 85 ºC, source and load VSWR < 1.2:1,
derate linearly to 0 W at T
CASE
= 150 ºC (note 1)
Junction to bottom surface of package
RF CW Incident Power Handling
Θ
JC
Thermal Resistance
Notes:
1
45 dBm
25ºC/W
T
CASE
is defined as the temperature of the bottom surface of the package
LM202802-M-C-300 Electrical Specifications
Parameter
Frequency
Insertion Loss
Return Loss
Input 1 dB Compression Point
2
ND
Harmonic
Peak Incident Power
CW Incident Power
Flat Leakage Power
Spike Leakage Energy
Recovery Time
Symbol
F
IL
RL
IP
1dB
2F
0
P
inc
(Pk)
P
inc
(CW)
FL
SL
T
R
Test Conditions
Z
0
= 50
Ω
, T
A
= 25ºC as measured in Aeroflex evaluation board (Unless Otherwise Defined)
Min.
Value
2
1.2
13
7
15
8
-50
10
-45
53
45
20
0.3
1500
22
0.5
2000
Typ.
Value
Max.
Value
8
1.4
Units
GHz
dB
dB
dBm
dBc
dBm
dBm
dBm
erg
ns
20 MHz
≤
F
≤
8 GHz,
P
IN
= 0 dBm
20 MHz
≤
F
≤
8 GHz,
P
IN
= 0 dBm
20 MHz
≤
F
≤
8 GHz
P
IN
= 0 dBm
F
0
= 2.0 GHz
RF Pulse Width = 1 µs, duty cycle = 0.001
20 MHz
≤
F
≤
8 GHz
P
IN
= 50 dBm peak, RF pulse width = 1 µs, duty
cycle = 0.1%
P
IN
= 50 dBm peak, RF pulse width = 1 µs, duty
cycle = 0.1%
50% falling edge of RF pulse to 1 dB IL, P
IN
= 50
dBm peak, RF pulse width = 1 µs, duty cycle = 0.1%,
603-641-3800 • 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13801 Rev.C, ECN 12906
Revision Date: 5/29/2013
3
PIN Diode Limiter
Evaluation Board
When a large signal is incident upon the input of the LM202802-M-C-300, the impedance of the coarse
limiter diodes is forced to a low value by the charge which is injected into these diodes by the large RF
voltage initially present across the internal diodes. As the impedance of these diodes decreases, an
increasingly large impedance mismatch with the impedance of the transmission line to which the limiter is
connected is created. Ultimately, the impedance of the coarse limiter diodes is reduced to a few ohms. This
mismatch creates a standing wave, with a current maximum located ideally at the position of the coarse
limiter diode. While the large majority of the input signal power is reflected back to its source due to the
impedance mismatch, the significant RF current that flows at the current maximum causes Joule heating to
occur in the coarse limiter diode, so there must be a path with minimal thermal resistance from the coarse
diode to the external system heat sink. Also, there must be a minimal electrical resistance and inductance
between the underside of the limiter module package and the system ground in order to achieve maximum
RF isolation between the input and the output of the limiter module.
For these reasons, it is imperative that there are no voids in the electrical and thermal paths directly under
the coarse limiter diode. Care must be taken when mounting the LM202802-M-C-300 to avoid voids in the
solder joint in the area along the lengthwise axis of the package, under and between the filled vias in the
AlN substrate of the module, which are shown in the diagram (above). It is also important to ensure no
solder voids exist between the limiter module RF ports and the PCB to which the limiter module is attached.
No greater than 50% of the remaining metalized area on the bottom of the package may contain solder
voids.
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603-641-3800 • 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13801 Rev.C, ECN 12906
Revision Date: 5/29/2013
PIN Diode Limiter
LM202802-M-C-300 Typical Performance
Z
0
= 50
Ω
, T
A
= 25ºC, P
IN
= 0 dBm as measured in the Aeroflex Metelics evaluation board (Unless Otherwise Defined)
2.45 GHz
Output Power vs. Input
Power, f = 2.45 GHz
603-641-3800 • 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Document No. DS 13801 Rev.C, ECN 12906
Revision Date: 5/29/2013
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