Leaded Oscillator, OCXO
Metal Package, Full Size DIP
I401
Series
I401 Package
Product Features:
Available in Both Sinewave and
HCMOS/TTL Compatible outputs
RoHS Compliant
Applications:
Telecommunications
Data Communications
Instrumentation
Test and Measurement
12.6
20.7
4
3
1
2
Frequency
Output Level
HC-MOS
TTL
Sine
Duty Cycle
Rise / Fall Time
Output Load
HC-MOS
TTL
Sine
Frequency Stability
Supply Voltage
Current (Warm Up)
Current @ 25
C
Control Voltage
Slope
Operating
Storage
1.000 MHz to 50.000 MHz
10 Max.
6 Min.
‘0’ = 0.1 Vcc Max., ‘1’ = 4.5 VDC Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
+4dBm, ±3dBm
50% ±10% or ±5% See Table
10 nS Max.
See Output Table
15 pF
50 ohms
See Frequency Stability Table
See Supply Voltage Table
15.24
0.86
0.048
7.62
400 mA @ 5 VDC, 170 mA @ 12 VDC Max.
120 mA @ 5 VDC, 60 mA @ 12 VDC Typ.
2.5 VDC ±2.0 VDC, ±8 ppm Min.
Positive
See Operating Temperature Table in Part Number Guide
-55
C to +125
C
Pin Connection
1 Control Voltage
2 GND
3 Output
4 Vcc
Dimension Units: mm
Part NumberGuide
Package
Input
Voltage
3 = 3.3 V
5 = 5.0 V
I401 -
9 = 12 V
6 = -10 C to +75 C
3 = -20 C to +70 C
Sample Part Number: I401-5151YV-20.000 MHz
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 /60 Max.
Operating
Temperature
7 = 0 C to +50 C
1 = 0 C to +70 C
Output
Frequency
Stability
(in ppm)
N =
1.0
Y =
0.5
1 =
0.25
2 =
0.1
3 =
0.05*
Voltage
Control
V = Controlled
F = Fixed
Frequency
1 = 10 TTL / 15pF HC-MOS
3 = 15pF HC-MOS
6 = 30pF
A = Sine
-20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Frequency, supply, and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
01/11_C
Specifications subject to change without notice
P
age 1
Leaded Oscillator, OCXO
Metal Package, Full Size DIP
Pb Free Solder Reflow Profile:
I401
Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXXXX (Part Number detail = I401-XXXXXX-Freq.)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
01/11_C
Specifications subject to change without notice
P
age 2
NXP MCU
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