A/D Converter, 8-Bit, 1 Func, Bipolar, CDIP24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | compli |
| ECCN code | 3A001.A.2.C |
| Converter type | A/D CONVERTER |
| JESD-30 code | R-XDIP-T24 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output bit code | OFFSET BINARY |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 5962-01-246-3700 | AM6148DCT | AM6148DCTB | AM6148DE | |
|---|---|---|---|---|
| Description | A/D Converter, 8-Bit, 1 Func, Bipolar, CDIP24 | A/D Converter, 8-Bit, 1 Func, Bipolar, CDIP24 | A/D Converter, 8-Bit, 1 Func, Bipolar, CDIP24 | A/D Converter, 8-Bit, 1 Func, Bipolar, CDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | compli | unknown | unknown | unknown |
| Converter type | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| Number of digits | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C |
| Output bit code | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| JESD-609 code | - | e0 | e0 | e0 |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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