2.5 mm x 3.2 mm Ceramic Package SMD TCXO
I547/I747 Series
Product Features:
Low Jitter, Non-PLL Based Output
Clipped Sinewave
Analog Compensation
Available
0.5 ppm Stability
Applications:
GPS
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
4
3.20
3
2.50
1
2
Frequency
GPS Frequencies
Frequency Tolerance @ 25
C
Frequency Stability
Vs Temperature
Vs Supply Voltage ( 5%)
Vs Load(10%)
Output Level
Clipped Sinewave
Output Load
Clipped Sinewave
Duty Cycle (HCMOS)
Frequency Slope
(2C steps from -20
C to +70
C)
Start Time (90% of Vp-p)
Aging
Supply Voltage
Current
Voltage Control
(I747)
Operating
Storage
Phase Noise
10Mhz to 52 Mhz
16.396Mhz, 16.3676Mhz, 16.367667Mhz, 19.200Mhz,
24.5535Mhz, 26.000Mhz
1.5 ppm
See Frequency Stability Table
0.1 ppm Max.
.0.2 ppm Max.
0.8 V p-p Min.
10K Ohms / 10 pF
50% ±10%
0.1 ppm /
C
1.2 Max.
0.10
1
2
4
3
0.65 +/-0.02
0.62 +/-0.02
0.10
Recommended Pad Layout
2.40
3.0 mS Max.
1 ppm / Year Max.
4
3
See Supply Voltage Table , tolerance
5%
1.5 mA Max
1.5 VDC
1.0 VDC,
5.0 ppm Min.
See Operating Temperature Table
-40
C to +85
C
-87 dBc/Hz @ 10 Hz
-112 dBc/Hz @ 100 Hz
-135 dBc/Hz @ 1KHz
-145 dBc/Hz @ 10 Khz
2.0
1
2
1.3
0.9
Pin
1
2
3
4
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
I547 (Clipped Sinewave TCXO)
I747 (Clipped Sinewave TCVCXO)
Part Number Guide
Operating Temperature
7 = 0 C to +50 C
1 = 0 C to +70 C
3 = -20 C to +70 C
5 = -30 C to +85 C
2 = -40 C to +85 C
Sample Part Number: I547-1Q3-20.000 Mhz
FrequencyStability vs Temperature
Supply Voltage
**Y =
0.5
ppm
**N =
1.0
ppm
**O =
1.5
ppm
**P =
2.0
ppm
Q =
2.5
ppm
R =
3.0
ppm
J =
5.0
ppm
3 = 3.3 V
7 = 3.0 V
2 = 2.7 V
1 = 1.8 V
Frequency
- 20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
8/09/11_E
Specifications subject to change without notice
Page 1
2.5 mm x 3.2 mm Ceramic Package SMD TCXO
Pb Free Solder Reflow Profile:
I547/I747 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I - Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
8/09/11_E
Specifications subject to change without notice
Page 2
Embedded System
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