4 Pad Ceramic Package, 5.5 mm x 11.9 mm
Product Features:
SMD Package
Supplied in Tape and Reel
Compatible with Leadfree Processing
ILCX05 Series
Applications:
PCMCIA Cards
Storage
PC’s
Wireless Lan
5.5
11.9
4
3
Frequency
3.5 MHz to 70 MHz
1
2
ESR (Equivalent Series Resistance)
3.5 MHz – 4.4 MHz
4.5 MHz – 6.9 MHz
7 MHz – 13.9 MHz
14 MHz – 25 MHz
rd
30 MHz – 70 MHz (3 O.T.)
200
Ω
Max.
100
Ω
Max.
70
Ω
Max.
50
Ω
Max.
100
Ω
Max.
H
1
2
4
3
Shunt Capacitance (C0)
Frequency Tolerance @ 25°
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
7 pF Max.
±30
ppm Standard (see Part Number Guide for more
options)
±50
ppm Standard (see Part Number Guide for more
options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 uW Max.
±5
ppm Max. / Year Standard
4.3
Connection Diagram
4
3
1
2
Recommended Pad Layout
2.4
2.1
0° C to +70° C Standard (see Part Number Guide for more
options)
-40° C to +85° C Standard
5.1
Storage
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX05 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX05 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX05 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2a
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12+/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
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