2 mm 4/5 Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
Solder Tail
• End-to-end stackable
• Select load capability
• Monoblockable
• Shoulder Pin
Press Fit
• End-to-end stackable
• Early mate late break for hot swapping (press-fit
EMLB adjusted by application tooling)
• Select load capability
• Monoblockable
• Push-on shoulder pin
• Optional feed-through tail for rear plug-up midplane
applications
• Accepts Universal Tooling
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the “RoHS compliance” section
of www.3Mconnector.com for compliance
information (RIA E1 & C1 apply)
Date Modified: May 10, 2010
MP2 Series
TS-1120-D
Sheet 1 of 4
Physical
Material: High Temp LCP
Flammability: UL 94V-0
Color: Beige
Insulation:
Contact:
Underplating: 50 µ" [1.27 µm] Nickel
Plating:
Material: Phosphor Bronze
Wiping Area: See Ordering Information
Solder Tails: See Ordering Information
Electrical
Insulation Resistance:
10
3
MΩ
Current Rating:
Signal: 1.5 A – All contacts simultaneously
Withstanding Voltage:
1,000 V
AC
Environmental
Temperature Rating:
-55°C to +125°C
Process Temperature Rating:
260°C (Profile per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
UL File No.: E68080
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
2 mm 4/5 Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
MP2 Series
POSITION X
"A" 6.00
.236
2.00
.079
POSITION 2
POSITION 1
15.80
.622
11.50
.453
1.40
.055
2.00
.079
17.00
.669
FOR SPECIAL MONOBLOCKS
AND PIN ARRANGEMENTS
CONTACT 3M SALES
REPRESENTATIVE
mm
[inch]
3.50
.138
Tolerance Unless Noted
0
mm
±3
0.0
±0.3
0.00
±0.13
12.00
.472
4 ROW PRODUCT
17.80
.701
13.52
.532
[ ] Dimensions for
Reference Only
MATING LENGTH
"B" TAIL LENGTH
14.00
.551
E D C B A
ROW
"C"
5 ROW PRODUCT
SOLDER TAIL
PRODUCT
PRESS FIT
PRODUCT
PRESS FIT
PRODUCT
REAR
PLUG-UP
Contact 3M For Rear Plug-Up Option
Notes:
1. Refer to IEC 61076-4-104 Futurebus+
®
global standard.
2. “Press Fit” describes a contact tail having a compliant section designed to make a reliable electrical connection with a plated
through-hole (PTH) in a printed circuit board, typically a “back plane.”
Ordering Information
MP2 - HXXX - XXXX - S - XXXXX
H = Header
Pin Count
(See Table 1)
Rows
4 = 4 Rows
5 = 5 Rows
Plating Options
(See Table 4)
Shouldered Pins
Tail Length
(See Table 3)
Loading Pattern
(See Table 2)
Termination Style
P = Press-Fit
S = Solder Tail
TS-1120-D
Sheet 2 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
Table 1 - Connector & Row Lengths
Pin Count
024
048
072
096
120
144
168
192
030
060
090
120
150
180
210
240
Dim. “A” mm
[inch]
11.95 [0.471]
23.95 [0.943]
35.95 [1.415]
47.95 [1.889]
59.95 [2.36]
71.95 [2.833]
83.95 [3.305]
95.95 [3.778]
11.95 [0.471]
23.95 [0.943]
35.95 [1.415]
47.95 [1.888]
59.95 [2.361]
71.95 [2.833]
83.95 [3.305]
95.95 [3.778]
Dim “C” mm
[inch]
10.00 [0.394]
22.00 [0.866]
34.00 [1.339]
46.00 [1.811]
58.00 [2.283]
70.00 [2.756]
82.00 [3.228]
94.00 [3.701]
10.00 [0.394]
22.00 [0.866]
34.00 [1.339]
46.00 [1.811]
58.00 [2.283]
70.00 [2.756]
82.00 [3.228]
94.00 [3.701]
Rows
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
KV
for rear
plug-up
only
LR
KR
TR30
Plating
Suffix
TG30
2 mm 4/5 Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
Table 4 - Plating Options
Press-Fit
Tails*
(RIA E2 &
C2 apply)
(RIA E2 &
C2 apply)
Solder
Tails
(RIA E3 &
C2 apply)
(RIA E3 &
C2 apply)
MP2 Series
Plating Composition
0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. Matt Whisker
Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. Matt Whisker
Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
0.76 μm [30 μ”] Min. Au Dual Contact Areas
0.10 μm [4 μ”] Min. Au Needle Eye
1.27 μm [50 μ”] Min. Ni all over
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
Table 3 - Tail Length Options
Plating Suffix
Solder Tail
1
3
*Compliant-Pin Tail
Press-Fit* Tail
1
Dim. “B”
4.60 [0.181]
2.72 [0.107]
Table 2 - Mate Length vs. Loading Pattern
Loading
Pattern Code
1
2
3
4
5
6
7
8
9
A
B
C
D
E
G
H
J
K
Description
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
All Positions Filled
Mate length Row A
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
7.25 [0.285]
6.50 [0.256]
6.50 [0.256]
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
7.25 [0.285]
5.00 [0.197]
8.00 [0.315]
5.00 [0.197]
Mate length Row B
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
6.50 [0.256]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
8.00 [0.315]
6.50 [0.256]
Mate length Row C
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
6.50 [0.256]
5.75 [0.226]
6.50 [0.256]
7.25 [0.285]
7.25 [0.285]
5.75 [0.226]
5.75 [0.226]
8.00 [0.315]
7.25 [0.285]
Mate length Row D
5.00 [0.197]
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.00 [0.197]
7.25 [0.285]
8.00 [0.315]
6.50 [0.256]
Mate length Row E
(5-Row Prod. Only)
5.00 [0.197]
5.00 [0.197]
6.50 [0.256]
6.50 [0.256]
5.75 [0.226]
5.75 [0.226]
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
5.00 [0.197]
5.75 [0.226]
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
5.00 [0.197]
7.25 [0.285]
8.00 [0.315]
5.00 [0.197]
TS-1120-D
Sheet 3 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
MetPak
™
2-FB Header
12.00
.472
16.00
.630 MIN
2.00
.079
2.00
.079
2 mm 4/5 Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
1 6 .0 0
. 6 3 0 M IN
MP2 Series
A1
12.00
.472
"C"
12.00
.472
"D" PLATED THRU HO LE
Ø
0.10
2.00
.079
1.50
+.10
-.00
6.00
.236
UNPLATED
CENTER HOLES OPTIONAL
FOR 3M PRODUCT
Ø
.059
+.004
-.000
Ø
0.10
"D " P L A T E D T H R U H O L E
Ø
0 .1 0
RECOMMENDED 4 ROW SOLDER
TAIL PCB HOLE MOUNTING PATTERN
RECOMMENDED 4 ROW PRESS-FIT
Table 5 – HOLE PLATING For TG30 and TR30 FINISHES ONLY
HOLE
“D”
Finished Dia. MM [in]
0.65-0.80 [.0256-.0315]
Cu Thickness [mm [in]
0.025 [.001] min.
SnPb Thickness microns [µ"]
15 [600] max.
Drilled Hole Dia. mm [in]
0.81-0.86 [.0319-.0339]
Table 6 – HOLE PLATING For KR, LR, and KV FINISHES ONLY
HOLE
Finished Dia.
MM [in]
0.700-0.800
[.0276-.0315]
Immersion Matte
Sn Thickness
microns [µ”]
0.025-0.045
[0.001-0.002]
Electrolytic Au
Thickness
microns [µ"]
0.1 - 0.5
[4 - 20]
OSP ENTEK
Thickness
microns [µ”]
0.2 - 0.5
[8 - 20]
Drilled Hole
Dia. mm [in]
0.830-0.860 [.0330-.0340] or
0.85 mm [#66] TWIST DRILL
“D”
14.00
.551
6.00
.236
2.00
.079
18.00
.709 MIN
2.00
.079
"D " P L A T E D T H R U H O L E
Ø
0 .1 0
A1
12.00
.472
"C"
12.00
.472
2.00
.079
Ø
1.50
.059
+.10
-.00
+.004
-.000
"D" PLATED THRU HOLE
Ø 0.10
CENTER HOLES OPTIONAL
FOR 3M PRODUCT
UNPLATED
1 8 .0 0
.7 0 9 M IN
Ø 0.10
RECOMMENDED 5 ROW SOLDER
TAIL PCB HOLE MOUNTING PATTERN
RECOMMENDED 5 ROW PRESS-FIT
PCB HOLE MOUNTING PATTERN
TS-1120-D
Sheet 4 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
Important Notice
All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness
is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated
with such use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order
shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M.
Warranty; Limited Remedy; Limited Liability.
This product will be free from defects in material and manufacture for a period of one (1) year from the time of purchase.
3M MAKES NO OTHER WARRANTIES
INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
If this product is defective within the
warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product.
Except
where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of
1. Main parameters of commonly used inductors
1. Inductance L
Inductance L is also called self-inductance coefficient, which is a physical quantity that represents the self-inductance ability of induc...
[align=center][color=rgb(18, 119, 221)][font=Fangzheng Lanting bold black, Microsoft elegant black][url=https://bbs.eeworld.com.cn/thread-926795-1-1.html]I am a great detective: looking for the lost T...
I found an example of Verilog driving MAX7219 on the Internet. The code is as follows:
module MAX7219(input clk_i,input rst_i,//inout wiresdo_i,//串行数据回读output reg sdin_o,//串行输出数据output reg sclk_o,//串行...
Xilinx, Inc. announced a solution that integrates Xilinx Automotive (XA) field programmable gate arrays (FPGAs) and intellectual property (IP). This integrated solution is included in the low-power In...
Event details: https://bbs.eeworld.com.cn/elecplay/content/147Product IntroductionAC7801x MCUAs an important field of MCU application, automotive electronics has a broad market space. However, due to ...
[i=s]This post was last edited by dql2016 on 2021-7-12 19:37[/i]In this project, there is a lighting control node, which is used to demonstrate how to integrate the RSL10 Bluetooth module into the RGB...
dql2016onsemi and Avnet IoT Innovation Design Competition
Assume that data is read from 8-bit AD (if it is a higher-bit AD, the data type can be defined as int), the subroutine is get_ad();
1. Limited secondary filtering
/* A value can be adjust...[Details]
Microchip's PIC18F46J50 is a low-power, high-performance 8-bit USB microcontroller (MCU) using nanoWatt XLP technology. The current in deep sleep mode can be as low as 13nA, the operating voltage i...[Details]
Floating-point digital signal processing has become a constant requirement for precision technology, often in applications requiring high accuracy in areas such as aviation, industrial machinery, a...[Details]
1 Introduction
Solar street lights are mainly composed of four parts: solar photovoltaic cell components, batteries, charge and discharge controllers, and lighting fixtures. The bo...[Details]
Introduction
Power subsystems are becoming more and more integrated into the overall system. Power systems have moved from being separate "essential dangerous devices" to being monitorable...[Details]
Two simple circuits are implemented to drive two LEDs from a battery powered microprocessor.
This design is based on a circuit that uses three resistors and a microprocessor I/O pin as an input h...[Details]
Microcalorimetry
is used to determine energy relationships. Microcalorimetry techniques are often required when performing calorimetric experiments with small sample sizes or slow heating rat...[Details]
Smart lighting control systems provide high controllability for various buildings and further enhance the level of green energy. They are the core products of energy conservation and digital techn...[Details]
With the continuous consumption of earth's energy and the scarcity of resources, the harm of greenhouse effect to human beings, and the serious pollution of the atmosphere to the earth, the intern...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
The traditional display screen using 51 single-chip microcomputer to control LED dot matrix has relatively simple functions. If it is to achieve diversified functions, it often takes a lot of time ...[Details]
Overview
In spectral measurement, photomultiplier tubes (PMT) and charge-coupled devices (CCD) are often used as photoelectric converters. PMT is used in slow-changing, high-precision spectral...[Details]
FPGAs are used in 81% of electronic systems, including many commercial and defense products, and most FPGAs use BGA packaging. The BGA packaging is characterized by small solder balls and small sol...[Details]
Continuity test
A variety of devices need to be checked for continuity, including cable assemblies, printed circuit boards, and connectors to ensure that these components have the expected contin...[Details]
1. Disadvantages of choosing too high a voltage level
Choosing too high a voltage level will result in too high an investment and a long payback period. As the voltage level increases, the...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
