SM Crystal for Wireless
Specifications
GSX-223
Parameters
Frequency range:
24.0 ~ 50.0MHz
Calibration tolerance:
±10ppm
±15ppm
±30ppm
Other values (±7.5 ~ ±100ppm)
±10ppm
±15ppm
±20ppm
±30ppm
Other values (±7.5 ~ ±100ppm)
Product
GSX-223
M
N
A
S
specify
F
1
P
3
specify
1
P
2
3
specify
1
2
3
specify
Option
Codes
Temperature stability:
2.05
±0.08
1.65
±0.08
0.60
(max)
SOLDER PAD LAYOUT
0.50
1
4
0.70
(typ)
PAD
1
2
3
4
CONNECTION
Crystal
Not connected
Crystal
Ground & lid
2
3
0.30
0.50
(typ)
4
1
3
2
0.85
0.85
Operating temperature range:
-10 to +60°C
-20 to +70°C
-30 to +80°C
Other values
Storage temperature range:
-40 to +85°C
Circuit condition:
8pF
9pF
10pF
Series resonant
Other values
Fundamental
0.95 0.95
TOP VIEW
Oscillation mode:
Equivalent series resistance:
100Ω max (24.0 ~ 36.0MHz)
60Ω max (36.0 ~ 50.0MHz)
Ageing:
±1ppm max first year
10μW
Features
Test drive level:
Ultra-miniature for maximum space saving
Ideal for wireless & mobile applications
Metal lid can be grounded to minimise EMI
Seam sealed for excellent long-term stability
Soldering condition:
260°C, 10 sec x2 max
Standard.
Optional - Please specify required code(s) when ordering
Ordering Information
Part No, or product name + option codes + frequency
eg:
GSX-223/111NF 26.0MHz
10/10/10/9-F
GSX-223/1P3AF 40.0MHz
10/15/30/10-F
Option code X (eg GSX-223/X) denotes a custom specification.
±10ppm temperature stability may not be available over -30+80°C.
Check with our sales office before ordering.
Tel:
+44 1460 256 100
10 Jul 2008
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Product Information
Construction
GSX-223
Ceramic body with gold-plated pads
Metal lid, seam sealed
Composition
This product is lead-free, and is fully compliant with
the RoHS directive 2002/95/EC
Pb
LeadFree
Packaging & Handling
Production quantities supplied on T&R, 3k pcs per reel.
Small quantities may be supplied on tape (no reel), or in bulk.
Soldering Profile
°C
10s max
Marking
FREQUENCY
T DC
Marking type: Laser
DC = Date code
260
200
Tape & Reel Specification
2.0 2.0
±0.02
0.2
1.0Ø 1.5Ø
1.75
100
5°C/s max
5°C/s max
5°
±0.05
3.5
MARK
2.30
8.0
±0.3
Preheat
140~160°C
0
60~90s max
Heat
> 200°C
50~60s max
Slow
cooldown
Time
0.60
1.90
Maximum solder resistance: 260°C x 10 secs x 2.
FEED
8.4
-0.4
1.5
120°
+0.6
±0.3
2.50
±0.2
20.5Ø
178Ø
±1.0
13Ø
60Ø
±1.0
Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated.
Tel:
+44 1460 256 100
10 Jul 2008
Fax:
+44 1460 256 101
E-mail:
sales@golledge.com
Web:
www.golledge.com
Embedded System
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