32-BIT, 4MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64
| Parameter Name | Attribute value |
| Maker | Motorola ( NXP ) |
| package instruction | WDIP, DIP64,.9 |
| Reach Compliance Code | unknow |
| ECCN code | 3A001.A.2.C |
| Address bus width | 23 |
| bit size | 32 |
| boundary scan | NO |
| maximum clock frequency | 4 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T64 |
| JESD-609 code | e0 |
| length | 60.96 mm |
| low power mode | NO |
| Number of terminals | 64 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP64,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.32 mm |
| speed | 4 MHz |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
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