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IS61WV51232BLL-10BI

Description
512K X 32 STANDARD SRAM, 10 ns, PBGA90
Categorystorage   
File Size217KB,19 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
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IS61WV51232BLL-10BI Overview

512K X 32 STANDARD SRAM, 10 ns, PBGA90

IS61WV51232BLL-10BI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals90
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.4 V
Rated supply voltage3.3 V
maximum access time10 ns
Processing package description8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, LOW PROFILE, FINE PITCH
surface mountYes
Terminal formBALL
Terminal spacing0.8000 mm
terminal coatingTIN SILVER COPPER
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width32
organize512K X 32
storage density1.68E7 deg
operating modeASYNCHRONOUS
Number of digits524288 words
Number of digits512K
Memory IC typeSTANDARD SRAM
serial parallelPARALLEL
IS61WV51232ALL/ALS
IS61WV51232BLL/BLS
IS64WV51232BLL/BLS
512K x 32 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
FEATURES
• High-speed access times:
8, 10, 20 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for greater
noise immunity
• Easy memory expansion with CE
and
OE
options
CE
power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single power supply
V
dd
1.65V to 2.2V (IS61WV51232Axx)
speed = 20ns for V
dd
1.65V to 2.2V
V
dd
2.4V to 3.6V (IS61/64WV51232Bxx)
speed = 10ns for V
dd
2.4V to 3.6V
speed = 8ns for V
dd
3.3V + 5%
• Packages available:
– 90-ball miniBGA (8mm x 13mm)
• Industrial and Automotive Temperature Support
• Lead-free available
JUNE 2016
high-speed, 16M-bit static RAMs organized as 512K words
by 32 bits. It is fabricated using
ISSI
's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
When
CE
is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be re-
duced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE
and
OE. The active LOW
Write Enable (WE)
controls both writing and reading of
the memory.
The device is packaged in the JEDEC standard 90-ball
BGA (8mm x 13mm).
DESCRIPTION
The
ISSI
IS61WV51232Axx/Bxx and IS64WV51232Bxx are
FUNCTIONAL BLOCK DIAGRAM
512K x 32
MEMORY ARRAY
A0-A18
DECODER
VDD
VSS
DQa-d
I/O
DATA
CIRCUIT
COLUMN I/O
CE
OE
WE
BWa-d
CE2
CONTROL
CIRCUIT
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
06/01/2016
1

IS61WV51232BLL-10BI Related Products

IS61WV51232BLL-10BI IS61WV51232ALL IS61WV51232ALL-20BI IS61WV51232ALS IS61WV51232BLL IS61WV51232BLS IS64WV51232BLL IS64WV51232BLL-10BA3 IS64WV51232BLS
Description 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90 512K X 32 STANDARD SRAM, 10 ns, PBGA90
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 90 90 90 90 90 90 90 90 90
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 125 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
Maximum supply/operating voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Processing package description 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90 8 X 13 MM, 0.80 MM PITCH, BGA-90 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-90
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Active-Unconfirmed ACTIVE
Craftsmanship CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package Size GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
surface mount Yes Yes Yes Yes Yes Yes Yes YES Yes
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal spacing 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm 0.8000 mm
terminal coating TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN SILVER COPPER
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL
memory width 32 32 32 32 32 32 32 32 32
organize 512K X 32 512K X 32 512K X 32 512K X 32 512K X 32 512K X 32 512K X 32 512KX32 512K X 32
storage density 1.68E7 deg 1.68E7 deg 1.68E7 deg 1.68E7 deg 1.68E7 deg 1.68E7 deg 1.68E7 deg 1.68E7 bit 1.68E7 deg
operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Memory IC type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
serial parallel PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
maximum access time 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns - 10 ns
Lead-free Yes Yes Yes Yes Yes Yes Yes - Yes
EU RoHS regulations Yes Yes Yes Yes Yes Yes Yes - Yes
Number of digits 512K 512K 512K 512K 512K 512K 512K 512K 512K

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