9mm x 14 mm Ceramic Package SMD Oscillator, LVPECL / LVDS
ISM68 Series
14.22 Max.
6
5
4
Product Features:
Surface Mount Package
Reflow Compatible
Compatible with Leadfree Processing
Applications:
Test Equipment
Server & Storage
Sonet /SDH
1
2
3
9.78 Max.
Frequency
Output Level
LVDS
LVPECL
Duty Cycle
Rise / Fall Time
Output Load
LVDS
LVPECL
Frequency Stability
Start-up Time
Enable / Disable
Time
Supply Voltage
Current
1 MHz to 750.000 MHz
4.7 Max.
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
0.6 nS Max.
Ref.
7.62
5.08
0.46
100 Differential
50 to Vcc - 2.0 VDC
See Frequency Stability Table in Part Numbering Guide (Includes room
temperature tolerance and stability over operating temperature)
10 mS Max.
100 nS Max.
See Input Voltage Table, tolerance ±5 %
LVDS = 90 mA Max., ***
LVPECL = 130 mA Max. ***
1.27
3.0
8.8
2.54
Operating
Storage
See Operating Temperature Table in Part Number Guide
-55 C to +125 C
Pin Connection
1
N.C.
2
Enable
3
GND
Pin
4
5
6
Connection
Output
Comp. Output
Vcc
Dimension Units: mm
Part Number Guide
Package
Input
Voltage
3 = 3.3 V
7 = 3.0 V
Sample Part Number:
Operating
Temperature
1 = 0 C to +70 C
6 = -10 C to +70 C
3 = -20 C to +70 C
4 = -30 C to +75 C
2 = -40 C to +85 C
I
SM68 - 3169BH - 156.250
Output
8 = LVDS
9 = LVPECL
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 / 60 Max.
Stability
(in ppm)
**A = 25
B = 50
C = 100
Enable /
Disable
H = Enable
Frequency
- 156.250 MHz
I
SM68 -
2 = 2.7 V
6 = 2.5 V
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 1
9mm x 14 mm Ceramic Package SMD Oscillator, LVPECL / LVDS
Pb Free Solder Reflow Profile:
ISM68 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09
Specifications subject to change without notice
Page 2
Embedded System
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