5 mm x 7 mm Ceramic Package SMD Oscillator, LVPECL / LVDS
ISM98 Series
Product Features:
Low Noise
Surface Mount Package
Reflow Compatible
Compatible with Leadfree Processing
Applications:
Test Equipment
Server & Storage
Sonet /SDH
Frequency
Output Level
LVDS
LVPECL
Duty Cycle
Rise / Fall Time
Output Load
LVDS
LVPECL
Frequency Stability
Start-up Time
Enable / Disable
Time
Supply Voltage
Current
1 MHz to 180.000 MHz
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
0.6 nS Max.
100
Ω
Differential
50
Ω
to Vcc - 2.0 VDC
See Frequency Stability Table in Part Number Guide (Includes room
temperature tolerance and stability over operating temperature)
10 mS Max.
100 nS Max.
Recommended Pad Layout
See Input Voltage Table, tolerance ±5 %
LVDS = 90 mA Max. ***
LVPECL = 130 mA Max. ***
Pin Connection
1
Enable
2
N.C.
3
GND
4
Output
5
Comp. Output
6
Vc
c
Dimension Units: mm
Jitter
Operating
Storage
<1.0 pS RMS*
See Operating Temperature Table in Part Number Guide
-55
°
C to +125
°
C
Part Number Guide
Package
Input
Voltage
3 = 3.3 V
7 = 3.0 V
Sample Part Number:
Operating
Temperature
1 = 0° C to +70° C
6 = -10° C to +70° C
3 = -20° C to +70° C
4 = -30° C to +75° C
2 = -40° C to +85° C
I
SM98 - 3159BH - 125.000
Output
8 = LVDS
9 = LVPECL
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 / 60 Max.
Stability
(in ppm)
**A =
±25
B =
±50
C =
±100
Enable /
Disable
H = Enable
Frequency
- 125.000 MHz
I
SM98 -
2 = 2.7 V
6 = 2.5 V
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
*Frequency related, for additional information contract your sales representative. ** Not available for all temperature ranges. *** Frequency, supply,
and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
Page 1
5 mm x 7 mm Ceramic Package SMD Oscillator, LVPECL / LVDS
ISM98 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
Page 2
PCB Design
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