3 x 64 x 8 Secure Memory with Authentication

| AT88SC153 | AT88SC153-09ET-00 | AT88SC153-09GT-00 | AT88SC153-09HT-00 | AT88SC153-09PT-00 | AT88SC153-10CI-00 | AT88SC153-10PI-00 | AT88SC153-10SI-00 | AT88SC153-10WI-00 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication | 3 x 64 x 8 Secure Memory with Authentication |
| Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) |
| Parts packaging code | - | CARD | CARD | CARD | CARD | SOIC | DIP | SOIC | WAFER |
| package instruction | - | , MODULE,8LEAD,.46 | , MODULE,8LEAD,.3 | , MODULE,8LEAD,.3 | , MODULE,8LEAD,.46 | SON, SOLCC8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIE, |
| Contacts | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | compli | compli | unknow |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | - | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| Data retention time - minimum | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 | - |
| Durability | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - |
| I2C control byte | - | DDDDCCCC | DDDDCCCC | DDDDCCCC | DDDDCCCC | DDDDCCCC | DDDDCCCC | DDDDCCCC | - |
| JESD-30 code | - | R-XXMA-X8 | R-XXMA-X8 | R-XXMA-X8 | R-XXMA-X8 | R-XDSO-N8 | R-PDIP-T8 | R-PDSO-G8 | X-XUUC-N |
| memory density | - | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi |
| Memory IC Type | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Humidity sensitivity level | - | 1 | 1 | 1 | 1 | - | 1 | - | - |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| word count | - | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | - | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| organize | - | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 |
| Package body material | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| Encapsulate equivalent code | - | MODULE,8LEAD,.46 | MODULE,8LEAD,.3 | MODULE,8LEAD,.3 | MODULE,8LEAD,.46 | SOLCC8,.3 | DIP8,.3 | SOP8,.25 | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | UNCASED CHIP |
| Parallel/Serial | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | - | 225 | 225 | 225 | 225 | 240 | 225 | 240 | - |
| power supply | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Serial bus type | - | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| Maximum standby current | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | - |
| Maximum slew rate | - | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | - |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | NO | NO | NO | YES | NO | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | NO LEAD | THROUGH-HOLE | GULL WING | NO LEAD |
| Terminal location | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | DUAL | DUAL | DUAL | UPPER |
| Maximum time at peak reflow temperature | - | 30 | 30 | 30 | 30 | 30 | 30 | 30 | - |
| Maximum write cycle time (tWC) | - | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| write protect | - | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | - |