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AT88SC153-09HT-00

Description
3 x 64 x 8 Secure Memory with Authentication
Categorystorage    storage   
File Size321KB,24 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT88SC153-09HT-00 Overview

3 x 64 x 8 Secure Memory with Authentication

AT88SC153-09HT-00 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeCARD
package instruction, MODULE,8LEAD,.3
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum100
Durability100000 Write/Erase Cycles
I2C control byteDDDDCCCC
JESD-30 codeR-XXMA-X8
memory density2048 bi
Memory IC TypeEEPROM
memory width1
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX1
Package body materialUNSPECIFIED
Encapsulate equivalent codeMODULE,8LEAD,.3
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)225
power supply3/5 V
Certification statusNot Qualified
Serial bus typeI2C
Maximum standby current0.000001 A
Maximum slew rate0.005 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formUNSPECIFIED
Terminal locationUNSPECIFIED
Maximum time at peak reflow temperature30
Maximum write cycle time (tWC)10 ms
write protectSOFTWARE
Features
One 64 x 8 (512-bit) Configuration Zone
Three 64 x 8 (512-bit) User Zones
Programmable Chip Select
Low-voltage Operation: 2.7V to 5.5V
Two-wire Serial Interface
8-byte Page Write Mode
Self-timed Write Cycle (10 ms max)
Answer-to-reset Register
High-security Memory Including Anti-wiretapping
– 64-bit Authentication Protocol (under exclusive patent license from ELVA)
– Secure Checksum
– Configurable Authentication Attempts Counter
– Two Sets of Two 24-bit Passwords
– Specific Passwords for Read and Write
– Four Password Attempts Counters
– Selectable Access Rights by Zone
ISO Compliant Packaging
High Reliability
– Endurance: 100,000 Cycles
– Data Retention: 100 Years
– ESD Protection: 4,000V min
Low-power CMOS
3 x 64 x 8
Secure Memory
with
Authentication
AT88SC153
Table 1.
Pin Configuration
Name
VCC
GND
SCL
SDA
RST
Description
Supply Voltage
Ground
Serial Clock Input
Serial Data
Input/Output
Reset Input
ISO Module Contact
C1
C5
C3
C7
C2
Standard Package Pin
8
1
6
3
7
Figure 1.
Card Module Contact
Figure 2.
8-pin SOIC, PDIP, or LAP
VCC
RST
GND
NC
SDA
NC
1
2
3
4
8
7
6
5
VCC
RST
SCL
NC
Description
The AT88SC153 provides 2,048 bits of serial EEPROM memory organized as one
configuration zone of 64 bytes and three user zones of 64 bytes each. This device is
optimized as a “secure memory” for multiapplication smart card markets, secure iden-
tification for electronic data transfer, or components in a system without the
requirement of an internal microprocessor.
1016D–SMEM–04/04
1

AT88SC153-09HT-00 Related Products

AT88SC153-09HT-00 AT88SC153 AT88SC153-09ET-00 AT88SC153-09GT-00 AT88SC153-09PT-00 AT88SC153-10CI-00 AT88SC153-10PI-00 AT88SC153-10SI-00 AT88SC153-10WI-00
Description 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication 3 x 64 x 8 Secure Memory with Authentication
Is it lead-free? Contains lead - Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead -
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible incompatible incompatible -
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip) - Atmel (Microchip)
Parts packaging code CARD - CARD CARD CARD SOIC DIP SOIC WAFER
package instruction , MODULE,8LEAD,.3 - , MODULE,8LEAD,.46 , MODULE,8LEAD,.3 , MODULE,8LEAD,.46 SON, SOLCC8,.3 DIP, DIP8,.3 SOP, SOP8,.25 DIE,
Contacts 8 - 8 8 8 8 8 8 -
Reach Compliance Code compli - compli compli compli compli compli compli unknow
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz - 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
Data retention time - minimum 100 - 100 100 100 100 100 100 -
Durability 100000 Write/Erase Cycles - 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles -
I2C control byte DDDDCCCC - DDDDCCCC DDDDCCCC DDDDCCCC DDDDCCCC DDDDCCCC DDDDCCCC -
JESD-30 code R-XXMA-X8 - R-XXMA-X8 R-XXMA-X8 R-XXMA-X8 R-XDSO-N8 R-PDIP-T8 R-PDSO-G8 X-XUUC-N
memory density 2048 bi - 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi 2048 bi
Memory IC Type EEPROM - EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 1 - 1 1 1 1 1 1 1
Humidity sensitivity level 1 - 1 1 1 - 1 - -
Number of functions 1 - 1 1 1 1 1 1 1
Number of terminals 8 - 8 8 8 8 8 8 -
word count 2048 words - 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 - 2000 2000 2000 2000 2000 2000 2000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C 85 °C
organize 2KX1 - 2KX1 2KX1 2KX1 2KX1 2KX1 2KX1 2KX1
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
Encapsulate equivalent code MODULE,8LEAD,.3 - MODULE,8LEAD,.46 MODULE,8LEAD,.3 MODULE,8LEAD,.46 SOLCC8,.3 DIP8,.3 SOP8,.25 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY SMALL OUTLINE IN-LINE SMALL OUTLINE UNCASED CHIP
Parallel/Serial SERIAL - SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 225 - 225 225 225 240 225 240 -
power supply 3/5 V - 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C - I2C I2C I2C I2C I2C I2C I2C
Maximum standby current 0.000001 A - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A -
Maximum slew rate 0.005 mA - 0.005 mA 0.005 mA 0.005 mA 0.005 mA 0.005 mA 0.005 mA -
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO - NO NO NO YES NO YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED NO LEAD THROUGH-HOLE GULL WING NO LEAD
Terminal location UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED DUAL DUAL DUAL UPPER
Maximum time at peak reflow temperature 30 - 30 30 30 30 30 30 -
Maximum write cycle time (tWC) 10 ms - 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
write protect SOFTWARE - SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE -

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