High-Speed, Closed-Loop Buffer
| LMH6559 | LMH6559_06 | LMH6559MA | LMH6559MAX | LMH6559MF | LMH6559MFX | |
|---|---|---|---|---|---|---|
| Description | High-Speed, Closed-Loop Buffer | High-Speed, Closed-Loop Buffer | High-Speed, Closed-Loop Buffer | High-Speed, Closed-Loop Buffer | High-Speed, Closed-Loop Buffer | High-Speed, Closed-Loop Buffer |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Parts packaging code | - | - | SOIC | SOIC | SOT-23 | SOT-23 |
| package instruction | - | - | SOIC-8 | SOIC-8 | SOT-23, 5 PIN | SOT-23, 5 PIN |
| Contacts | - | - | 8 | 8 | 5 | 5 |
| Reach Compliance Code | - | - | _compli | _compli | _compli | _compli |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | - | - | BUFFER | BUFFER | BUFFER | BUFFER |
| Maximum average bias current (IIB) | - | - | 14 µA | 14 µA | 14 µA | 14 µA |
| Nominal bandwidth (3dB) | - | - | 1050 MHz | 1050 MHz | 1050 MHz | 1050 MHz |
| Maximum input offset voltage | - | - | 25000 µV | 25000 µV | 25000 µV | 25000 µV |
| JESD-30 code | - | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 |
| length | - | - | 4.902 mm | 4.902 mm | 2.92 mm | 2.92 mm |
| Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 |
| Negative supply voltage upper limit | - | - | -6.5 V | -6.5 V | -6.5 V | -6.5 V |
| Nominal Negative Supply Voltage (Vsup) | - | - | -5 V | -5 V | -5 V | -5 V |
| Number of functions | - | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | - | 8 | 8 | 5 | 5 |
| Maximum operating temperature | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| Minimum output current | - | - | 0.05 A | 0.05 A | 0.05 A | 0.05 A |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | SOP | SOP | LSSOP | LSSOP |
| Encapsulate equivalent code | - | - | SOP8,.25 | SOP8,.25 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | - | - | 235 | 235 | 260 | 260 |
| power supply | - | - | 3/5/+-5 V | 3/5/+-5 V | 3/5/+-5 V | 3/5/+-5 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1.753 mm | 1.753 mm | 1.22 mm | 1.22 mm |
| Nominal slew rate | - | - | 4580 V/us | 4580 V/us | 4580 V/us | 4580 V/us |
| Maximum slew rate | - | - | 17 mA | 17 mA | 17 mA | 17 mA |
| Supply voltage upper limit | - | - | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | YES | YES | YES | YES |
| technology | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | - | - | 1.27 mm | 1.27 mm | 0.95 mm | 0.95 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 40 | 40 |
| width | - | - | 3.899 mm | 3.899 mm | 1.6 mm | 1.6 mm |
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