LMH6559MF datasheet, PDF - EEWORLD Datasheet

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LMH6559MF: DescriptionHigh-Speed, Closed-Loop Buffer; CategoryAnalog mixed-signal IC Amplifier circuit; File Size1MB，22 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LMH6559MF Overview

High-Speed, Closed-Loop Buffer

LMH6559MF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Parts packaging code	SOT-23
package instruction	SOT-23, 5 PIN
Contacts	5
Reach Compliance Code	_compli
ECCN code	EAR99
Amplifier type	BUFFER
Maximum average bias current (IIB)	14 µA
Nominal bandwidth (3dB)	1050 MHz
Maximum input offset voltage	25000 µV
JESD-30 code	R-PDSO-G5
JESD-609 code	e0
length	2.92 mm
Humidity sensitivity level	1
Negative supply voltage upper limit	-6.5 V
Nominal Negative Supply Voltage (Vsup)	-5 V
Number of functions	1
Number of terminals	5
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Minimum output current	0.05 A
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Encapsulate equivalent code	TSOP5/6,.11,37
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5/+-5 V
Certification status	Not Qualified
Maximum seat height	1.22 mm
Nominal slew rate	4580 V/us
Maximum slew rate	17 mA
Supply voltage upper limit	6.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.95 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	1.6 mm
Base Number Matches	1

LMH6559MF Related Products

	LMH6559MF	LMH6559_06	LMH6559	LMH6559MA	LMH6559MAX	LMH6559MFX
Description	High-Speed, Closed-Loop Buffer	High-Speed, Closed-Loop Buffer	High-Speed, Closed-Loop Buffer	High-Speed, Closed-Loop Buffer	High-Speed, Closed-Loop Buffer	High-Speed, Closed-Loop Buffer
Is it Rohs certified?	incompatible	-	-	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	-	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	SOT-23	-	-	SOIC	SOIC	SOT-23
package instruction	SOT-23, 5 PIN	-	-	SOIC-8	SOIC-8	SOT-23, 5 PIN
Contacts	5	-	-	8	8	5
Reach Compliance Code	_compli	-	-	_compli	_compli	_compli
ECCN code	EAR99	-	-	EAR99	EAR99	EAR99
Amplifier type	BUFFER	-	-	BUFFER	BUFFER	BUFFER
Maximum average bias current (IIB)	14 µA	-	-	14 µA	14 µA	14 µA
Nominal bandwidth (3dB)	1050 MHz	-	-	1050 MHz	1050 MHz	1050 MHz
Maximum input offset voltage	25000 µV	-	-	25000 µV	25000 µV	25000 µV
JESD-30 code	R-PDSO-G5	-	-	R-PDSO-G8	R-PDSO-G8	R-PDSO-G5
JESD-609 code	e0	-	-	e0	e0	e0
length	2.92 mm	-	-	4.902 mm	4.902 mm	2.92 mm
Humidity sensitivity level	1	-	-	1	1	1
Negative supply voltage upper limit	-6.5 V	-	-	-6.5 V	-6.5 V	-6.5 V
Nominal Negative Supply Voltage (Vsup)	-5 V	-	-	-5 V	-5 V	-5 V
Number of functions	1	-	-	1	1	1
Number of terminals	5	-	-	8	8	5
Maximum operating temperature	85 °C	-	-	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-	-40 °C	-40 °C	-40 °C
Minimum output current	0.05 A	-	-	0.05 A	0.05 A	0.05 A
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LSSOP	-	-	SOP	SOP	LSSOP
Encapsulate equivalent code	TSOP5/6,.11,37	-	-	SOP8,.25	SOP8,.25	TSOP5/6,.11,37
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	-	-	235	235	260
power supply	3/5/+-5 V	-	-	3/5/+-5 V	3/5/+-5 V	3/5/+-5 V
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.22 mm	-	-	1.753 mm	1.753 mm	1.22 mm
Nominal slew rate	4580 V/us	-	-	4580 V/us	4580 V/us	4580 V/us
Maximum slew rate	17 mA	-	-	17 mA	17 mA	17 mA
Supply voltage upper limit	6.5 V	-	-	6.5 V	6.5 V	6.5 V
Nominal supply voltage (Vsup)	5 V	-	-	5 V	5 V	5 V
surface mount	YES	-	-	YES	YES	YES
technology	BIPOLAR	-	-	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	INDUSTRIAL	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	-	GULL WING	GULL WING	GULL WING
Terminal pitch	0.95 mm	-	-	1.27 mm	1.27 mm	0.95 mm
Terminal location	DUAL	-	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	-	-	30	30	40
width	1.6 mm	-	-	3.899 mm	3.899 mm	1.6 mm

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