5962-9461003HYA datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-9461003HYA

5962-9461003HYA: DescriptionFlash Module, 128KX32, 120ns, HIP-66; Categorystorage storage; File Size3MB，939 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

Download Datasheet Parametric View All

5962-9461003HYA Overview

Flash Module, 128KX32, 120ns, HIP-66

5962-9461003HYA Parametric

Parameter Name	Attribute value
Maker	Microsemi
package instruction	HIP-66
Reach Compliance Code	unknown
Maximum access time	120 ns
Data polling	NO
JESD-30 code	S-XHIP-P66
JESD-609 code	e0
length	30.1 mm
memory density	4194304 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	UNSPECIFIED
encapsulated code	HIP
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	6.22 mm
Maximum standby current	0.0065 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
switch bit	NO
type	NOR TYPE
width	30.1 mm

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

Low Q Gain Band Pass Filter Amplifier

Timing circuit composed of PUT lamp

Low cost fluorescent lamp electronic ballast circuit

Multiple feedback low-pass filter circuit

614-B2 (3kVA) AC voltage regulator circuit

pulse width modulation circuit

Find embedded boards: I'm looking for an embedded board to take pictures, so I need a large memory, about 1G, and install Linux OS. Has anyone used it?...; hellodsp Embedded System

Innovative design of shake stick (32 lights): My shake stick has a streamlined design and uses 8 IO ports to drive 32 lights, which works very well. Friends who are interested, please visit my space! Address: http://hi.baidu.com/fcping/ If you wa...; 77554971 DIY/Open Source Hardware

Package size issue: [font=Times New Roman]【If you don't understand, ask】[/font] [font=Times New Roman]The picture shows the package size of a film capacitor. What does b mean? D stands for the diameter of the pin[/font]...; shaorc PCB Design

Why are relays still used to drive automotive motors?: [align=left][color=#000][font="][size=3]With the increasing adoption of smaller and smarter integrated circuits (ICs) in automotive electrical systems, it’s time to start addressing a familiar questio...; qwqwqw2088 Analogue and Mixed Signal

What are the changes in the maximum output current and load limit of a differential output amplifier when it is single-ended output?: What are the changes in the maximum output current and load limit of a differential output amplifier when it is single-ended output?...; aigtekatdz Test/Measurement

[Mobile phone DIY] Xin Xin 3: Build the hardware, as shown above, poor welding is a major flaw: [size=3][font=宋体]Poor welders are really a flaw. Moreover, this is the first time that the motherboard uses a unified motherboard header. The module uses a unified pin header, which is not so easy to ...; 辛昕 DIY/Open Source Hardware

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components