5962-9461301HXA datasheet, PDF

5962-9461301HXA: DescriptionFlash Module, 1MX32, 150ns, HIP-66; Categorystorage storage; File Size1MB，24 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461301HXA Overview

Flash Module, 1MX32, 150ns, HIP-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	HIP-66
Reach Compliance Code	unknown
Maximum access time	150 ns
Data polling	NO
JESD-30 code	S-XHIP-P66
JESD-609 code	e0
length	35.2 mm
memory density	33554432 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of departments/size	32
Number of terminals	66
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX32
Package body material	UNSPECIFIED
encapsulated code	HIP
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12 V
Certification status	Not Qualified
ready/busy	YES
Filter level	MIL-STD-883
Maximum seat height	6.22 mm
Department size	32K
Maximum standby current	0.0002 A
Maximum slew rate	0.18 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	35.2 mm

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