MSP430F5438ACYS datasheet, PDF

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MSP430F5438ACYS: Description16-bit Microcontrollers - MCU 5XX 25MHZ SERIES - 16-BIT ULTRA-LOW-POWER MICROCONTROLLER, 256KB FLASH, 16KB RAM, 12 BIT ADC, 4 USCIS, 32-BIT HW MULTI; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，115 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MSP430F5438ACYS Overview

16-bit Microcontrollers - MCU 5XX 25MHZ SERIES - 16-BIT ULTRA-LOW-POWER MICROCONTROLLER, 256KB FLASH, 16KB RAM, 12 BIT ADC, 4 USCIS, 32-BIT HW MULTI

MSP430F5438ACYS Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	WAFER
package instruction	DIE,
Reach Compliance Code	unknow
Has ADC	YES
Other features	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ
Address bus width
bit size	16
maximum clock frequency	18 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	R-XUUC-N
PWM channel	YES
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Certification status	Not Qualified
ROM programmability	FLASH
speed	25 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.4 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	UPPER
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

MSP430F5438ACYS Related Products

	MSP430F5438ACYS	MSP430F5419AIZQWR	MSP430F5435AIPNR	MSP430F5438ACY	MSP430F5438AIZQWR
Description	16-bit Microcontrollers - MCU 5XX 25MHZ SERIES - 16-BIT ULTRA-LOW-POWER MICROCONTROLLER, 256KB FLASH, 16KB RAM, 12 BIT ADC, 4 USCIS, 32-BIT HW MULTI	16-Bit Ultra-Low-Power Microcontroller, 128KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 192KB Flash, 16KB RAM, 12 Bit ADC, 2 USCIs, 32-bit HW Multi 80-LQFP -40 to 85	16-bit Microcontrollers - MCU DIE PKG	16-Bit Ultra-Low-Power Microcontroller, 256KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85
Parts packaging code	WAFER	BGA	QFP	DIE	BGA
package instruction	DIE,	VFBGA, BGA113,12X12,20	LQFP-80	DIE,	VFBGA, BGA113,12X12,20
Reach Compliance Code	unknow	compli	compliant	compli	compli
Has ADC	YES	YES	YES	YES	YES
Other features	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	ITS ALSO OPERATES MINIMUM 1.8V AT 12MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ
bit size	16	16	16	16	16
maximum clock frequency	18 MHz	18 MHz	18 MHz	18 MHz	18 MHz
DAC channel	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES
JESD-30 code	R-XUUC-N	S-PBGA-B113	S-PQFP-G80	R-XUUC-N	S-PBGA-B113
PWM channel	YES	YES	YES	YES	YES
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	DIE	VFBGA	LFQFP	DIE	VFBGA
Package shape	RECTANGULAR	SQUARE	SQUARE	UNSPECIFIED	SQUARE
Package form	UNCASED CHIP	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	UNCASED CHIP	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH
speed	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.4 V	2.2 V	2.2 V	2.4 V	2.2 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	NO LEAD	BALL	GULL WING	NO LEAD	BALL
Terminal location	UPPER	BOTTOM	QUAD	UPPER	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	-
Brand Name	-	Texas Instruments	Texas Instruments	-	Texas Instruments
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to
Contacts	-	113	80	-	113
ECCN code	-	EAR99	EAR99	-	EAR99
Factory Lead Time	-	1 week	6 weeks	6 weeks	1 week
boundary scan	-	YES	YES	-	YES
CPU series	-	MSP430	MSP430	-	MSP430
Format	-	FIXED POINT	FIXED POINT	-	FIXED POINT
Integrated cache	-	NO	NO	-	NO
JESD-609 code	-	e1	e4	-	e1
length	-	7 mm	12 mm	-	7 mm
low power mode	-	YES	YES	-	YES
Humidity sensitivity level	-	3	3	-	3
Number of DMA channels	-	3	3	-	3
Number of I/O lines	-	87	67	-	87
Number of serial I/Os	-	3	3	-	3
Number of terminals	-	113	80	-	113
Number of timers	-	15	15	-	15
On-chip data RAM width	-	8	8	-	8
On-chip program ROM width	-	8	8	-	8
Maximum operating temperature	-	85 °C	85 °C	-	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-	-40 °C
Encapsulate equivalent code	-	BGA113,12X12,20	QFP80,.55SQ,20	-	BGA113,12X12,20
Peak Reflow Temperature (Celsius)	-	260	260	NOT SPECIFIED	260
power supply	-	2/3.3 V	2/3.3 V	-	2/3.3 V
RAM (bytes)	-	16384	16384	-	16384
RAM (number of words)	-	16	16	-	16
rom(word)	-	131072	196608	-	262144
Maximum seat height	-	1 mm	1.6 mm	-	1 mm
Maximum slew rate	-	9.6 mA	9.6 mA	-	9.6 mA
Temperature level	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal pitch	-	0.5 mm	0.5 mm	-	0.5 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	7 mm	12 mm	-	7 mm
Base Number Matches	-	1	1	-	1

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