MSP430F5438AIZQWR datasheet, PDF

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MSP430F5438AIZQWR: Description16-Bit Ultra-Low-Power Microcontroller, 256KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，115 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430F5438AIZQWR Overview

16-Bit Ultra-Low-Power Microcontroller, 256KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85

MSP430F5438AIZQWR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFBGA, BGA113,12X12,20
Contacts	113
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Confidence
Samacsys Status	Released
Samacsys PartID	606451
Samacsys Pin Cou	113
Samacsys Part Category	Integrated Circui
Samacsys Package Category	Othe
Samacsys Footprint Name	BGA113C50P12X12_700X700X100
Samacsys Released Date	2017-01-12 12:59:53
Is Samacsys	N
Has ADC	YES
Other features	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ
Address bus width
bit size	16
boundary scan	YES
CPU series	MSP430
maximum clock frequency	18 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PBGA-B113
JESD-609 code	e1
length	7 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	3
Number of external interrupt devices
Number of I/O lines	87
Number of serial I/Os	3
Number of terminals	113
Number of timers	15
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA113,12X12,20
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	16384
RAM (number of words)	16
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1 mm
speed	25 MHz
Maximum slew rate	9.6 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.2 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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Description	16-Bit Ultra-Low-Power Microcontroller, 256KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 128KB Flash, 16KB RAM, 12 Bit ADC, 4 USCIs, 32-bit HW Multi 113-BGA MICROSTAR JUNIOR -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 192KB Flash, 16KB RAM, 12 Bit ADC, 2 USCIs, 32-bit HW Multi 80-LQFP -40 to 85	16-bit Microcontrollers - MCU DIE PKG	16-bit Microcontrollers - MCU 5XX 25MHZ SERIES - 16-BIT ULTRA-LOW-POWER MICROCONTROLLER, 256KB FLASH, 16KB RAM, 12 BIT ADC, 4 USCIS, 32-BIT HW MULTI
Parts packaging code	BGA	BGA	QFP	DIE	WAFER
package instruction	VFBGA, BGA113,12X12,20	VFBGA, BGA113,12X12,20	LQFP-80	DIE,	DIE,
Reach Compliance Code	compli	compli	compliant	compli	unknow
Has ADC	YES	YES	YES	YES	YES
Other features	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	ITS ALSO OPERATES MINIMUM 1.8V AT 12MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ	IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ
bit size	16	16	16	16	16
maximum clock frequency	18 MHz	18 MHz	18 MHz	18 MHz	18 MHz
DAC channel	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B113	S-PBGA-B113	S-PQFP-G80	R-XUUC-N	R-XUUC-N
PWM channel	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA	LFQFP	DIE	DIE
Package shape	SQUARE	SQUARE	SQUARE	UNSPECIFIED	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	UNCASED CHIP	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH
speed	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.2 V	2.2 V	2.2 V	2.4 V	2.4 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	GULL WING	NO LEAD	NO LEAD
Terminal location	BOTTOM	BOTTOM	QUAD	UPPER	UPPER
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	-	-
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	-
Contacts	113	113	80	-	-
ECCN code	EAR99	EAR99	EAR99	-	-
Factory Lead Time	1 week	1 week	6 weeks	6 weeks	-
boundary scan	YES	YES	YES	-	-
CPU series	MSP430	MSP430	MSP430	-	-
Format	FIXED POINT	FIXED POINT	FIXED POINT	-	-
Integrated cache	NO	NO	NO	-	-
JESD-609 code	e1	e1	e4	-	-
length	7 mm	7 mm	12 mm	-	-
low power mode	YES	YES	YES	-	-
Humidity sensitivity level	3	3	3	-	-
Number of DMA channels	3	3	3	-	-
Number of I/O lines	87	87	67	-	-
Number of serial I/Os	3	3	3	-	-
Number of terminals	113	113	80	-	-
Number of timers	15	15	15	-	-
On-chip data RAM width	8	8	8	-	-
On-chip program ROM width	8	8	8	-	-
Maximum operating temperature	85 °C	85 °C	85 °C	-	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-
Encapsulate equivalent code	BGA113,12X12,20	BGA113,12X12,20	QFP80,.55SQ,20	-	-
Peak Reflow Temperature (Celsius)	260	260	260	NOT SPECIFIED	-
power supply	2/3.3 V	2/3.3 V	2/3.3 V	-	-
RAM (bytes)	16384	16384	16384	-	-
RAM (number of words)	16	16	16	-	-
rom(word)	262144	131072	196608	-	-
Maximum seat height	1 mm	1 mm	1.6 mm	-	-
Maximum slew rate	9.6 mA	9.6 mA	9.6 mA	-	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	-
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	7 mm	7 mm	12 mm	-	-
Base Number Matches	1	1	1	-	-
Maker	-	-	Texas Instruments	Texas Instruments	Texas Instruments

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