WED8LM32129C-17EITA datasheet, PDF

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WED8LM32129C-17EITA: DescriptionSRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68; Categorystorage storage; File Size155KB，6 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WED8LM32129C-17EITA Overview

SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

WED8LM32129C-17EITA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	17 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
JESD-30 code	S-CQFP-G68
length	23.88 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	23.88 mm

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WED8LM32129C

HI-RELIABILITY PRODUCT

128Kx32 SRAM MODULE

FEATURES

Access Times of 15, 17, 20, 25, 35, 45, 55ns

Packaging

PRELIMINARY*

• 68 lead, 23.88mm Low Profile CQFP, 3.56mm (0.140")

Organized as 128Kx32; User Configurable as 256Kx16 or

512Kx8

Commercial, Industrial and Military Temperature Ranges

5 Volt Power Supply

Low Power CMOS

TTL Compatible Inputs and Outputs

Built in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

Device is upgradeable to 512Kx32

* This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

FIG. 1

PIN CONFIGURATION FOR WED8LM32129C-E

TOP VIEW

GND

PIN DESCRIPTION

I/O

0-31

0-16

I/O

GND

I/O

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61

I/O

GND

I/O

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

1-4

0.940"

GND

The WEDC 68 lead CQFP fills

the same fit and function as the

JEDEC 68 lead CQFJ or 68

PLCC. But the CQFP has the

TCE and lead inspection

advantage of the CQFP form.

BLOCK DIAGRAM

0-16

128K x 8

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

July 1999 Rev. 0

White Electronic Designs Corporation • (602) 437-1520 • www.whitedc.com

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